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The Knowledge Base: Enhancing Customer Loyalty and Product QualityIPC Extends Deadline on Call for Participation for IPC APEX EXPO 2019
June 25, 2018 | IPCEstimated reading time: 1 minute
IPC — Association Connecting Electronics Industries has extended the deadline of their invitation for engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2019 to be held at the San Diego Convention Center. The technical conference will take place January 29–31, 2019. The extended deadline for technical conference abstracts is June 29, 2018.
The industry’s premier conference and exhibition for the electronics industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide. Staff from companies such as Ericsson, Flex, IBM, Indium, MacDermid-Enthone, Northrop Grumman, Oracle and Robert Bosch have presented papers at past technical conference sessions at IPC APEX EXPO. To recognize exceptional achievement, awards will be presented for “Best Paper.”
Expert papers and presentations are being sought on design, materials, assembly, processes, test, reliability and equipment in the following areas:
- 3D Printing in Electronics Manufacturing
- Automation in Electronics Manufacturing
- Adhesives
- Advanced Technology
- Area Array/Flip Chip/0201 Metric
- Assembly and Rework Processes
- BGA/CSP Packaging
- Black Pad and Other Board Related Defect Issues
- BTC/QFN/LGA Components
- Business & Supply Chain Issues
- Cleaning
- Conformal Coatings
- Corrosion
- Counterfeit Electronics
- Design
- Electromigration
- Electronics Manufacturing Services
- Embedded Passive & Active Devices
- Environmental Compliance
- Graphene in Electronics Manufacturing
- Lean Six Sigma
- LED Manufacturing
- Failure Analysis
- Flexible Circuitry
- HDI Technologies
- Head-on-Pillow
- Board and Component Warpage
- High Speed, High Frequency & Signal
- Industry 4.0
- Integrity
- Lead-Free Fabrication, Assembly & Reliability
- Miniaturization Nanotechnology Optoelectronics
- Packaging & Components
- PCB Fabrication
- PCB and Component Storage & Handling Performance
- Quality & Reliability
- Photovoltaics
- PoP (Package-on-Package)
- Printed Electronics
- Reshoring
- RFID Circuitry
- Robotics
- Soldering
- Surface Finishes
- Test, Inspection & AOI
- Tin Whiskers
- 2.5-D/3-D Component Packaging
- Underfills
- Via Plugging & Other Protection
- Wearables
An approximate 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest and contain appropriate technical test results.
Technical conference paper abstracts are due June 29, 2018; to submit an abstract click here.
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