Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
Indium’s Seven Liang to Present at CEIA Guiyang Seminar
July 10, 2018 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation’s Seven Liang, Area Technical Manager for Shenzhen, will share his technical expertise at the CEIA Guiyang Seminar on July 26 in Guiyang, China.
Liang’s presentation, How Solder Materials Influence Reliability, will review how materials can be used to solve some of the top industry challenges including head-in-pillow, non-wet opens, graping, and SIR performance. He will also discuss what materials to use to ensure the high reliability of the final assembly and share the methods and test results of high-reliability alloys.
Indium Corporation will also be exhibiting at the seminar. Their booth will feature their high-reliability, low-voiding products, such as Indium8.9HF Solder Paste, Indium10.1HF Solder Paste, and precision gold-tin preforms. Technical experts will be available at the booth to answer questions about the presentation and help resolve customers’ assembly challenges.
Liang provides technical support for Indium Corporation’s electronics assembly materials, semiconductor and advanced assembly materials, engineered solders, and thermal management materials. He has more than a decade of experience in surface mount technology.
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, click here.
Share on:
Suggested Items
SHENMAO Strengthens Semiconductor Capabilities with Acquisition of PMTC
07/10/2025 | SHENMAOSHENMAO America, Inc. has announced the acquisition of Profound Material Technology Co., Ltd. (PMTC), a premier Taiwan-based manufacturer of high-performance solder balls for semiconductor packaging.
KYZEN to Highlight Understencil and PCB Cleaners at SMTA Querétaro Expo and Tech Forum
07/09/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Querétaro Expo & Tech Forum, scheduled to take place Thursday, July 24, at Centro de Congresos y Teatro Metropolitano de Querétaro.
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A