-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
Soldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
High-Speed Selective Soldering from SEHO at NEPCON South China
July 23, 2018 | SEHO Systems GmbHEstimated reading time: 1 minute
SEHO Systems GmbH plans to exhibit at NEPCON South China, scheduled to take place Aug. 28-30, 2018 at the Shenzhen Convention & Exhibition Center. The company will showcase the MaxiSelective-HS – the selective soldering system for maximum throughput requirements in Booth 1D10.
The MaxiSelective-HS is high quality soldering solution when short cycle times are required. Parallel processes in the fluxing, preheating and soldering area, simultaneous contact of all solder joints with product specific multi-nozzle soldering tools, and the parallel transfer of the assemblies to the next work station make this the ideal system for mass production.
Two basic machine versions of the MaxiSelective-HS can be equipped with four or six stations working in parallel both offer the flexibility needed to meet your individual production requirements. Additional buffer stations at the inlet and outlet of the machine complete this high-speed system. In order to meet complex production challenges or o respond to increasing manufacturing volumes, the MaxiSelective-HS can be expanded with additional modules or it may be combined with other machine types at a later date.
Of course, the MaxiSelective-HS provides outstanding features for automated process control. Flux quantity monitoring, gradient-controlled temperature profiles, solder level control with automatic wire supply and an automated wave height control are only some of the machine’s highlights.
For further information, please visit SEHO at NEPCON South China here.
Suggested Items
Technica Installs CBT/MLI Direct Imaging System at Summit Interconnect Santa Clara
01/14/2025 | Technica USATechnica has recently installed the 6th CBT/MLI Direct Imaging (DI) system at Summit Interconnect's Santa Clara operation, a testament to Summit's ongoing commitment to cutting-edge technology and operational excellence.
Indium to Showcase Power Electronics Products at NEPCON Japan
01/14/2025 | Indium CorporationAs one of the leading materials providers in the electronics assembly industry, Indium Corporation® is proud to feature its lineup of high-reliability products for power electronics at NEPCON Japan, taking place January 22-24, in Tokyo, Japan.
SolderKing to Highlight Innovations in Soldering and Manufacturing Efficiency at Southern Manufacturing & Electronics 2025
01/08/2025 | SolderKing Assembly Materials Ltd,SolderKing, a leading UK manufacturer of advanced soldering materials and consumables, will be exhibiting at the Southern Manufacturing and Electronics Show from 4-6 February 2025 at the Farnborough International Exhibition Centre, Stand J90.
Altus Highlights Heller Industries Advances in Void Reduction Under 1%
01/06/2025 | Altus GroupAltus Group, a leading distributor of capital equipment in the UK and Ireland, emphasises the importance of reducing voids in reflow soldering to improve manufacturing efficiency and product reliability
IPC Announces UK Regional Qualification for Hand Soldering Competition
01/02/2025 | IPCIPC invites skilled soldering experts to participate in the UK Regional Qualification for the IPC Hand Soldering Competition (HSC) on February 4-6, 2025, at the Farnborough International Exhibition Centre.