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Industry Veteran Nolan Johnson Joins I-Connect007 Editorial Team
July 30, 2018 | I-Connect007Estimated reading time: 1 minute
I-Connect007 welcomes the recent addition of industry veteran Nolan Johnson to its editorial team. In his new position, Johnson will take over as lead editor of SMT007 Magazine and PCB007 Magazine.
Nolan brings 30 years of career experience focused almost entirely on electronics design and manufacturing. Trained as a software engineer, he wrote applications software for Mentor Graphics, where he managed Mentor's initial OEM IC verification products, including Dracula, CheckMate, and ICVerify. He then managed a series of technical training centers at ESI, Tektronix, and Synetics Solutions. In addition, Nolan held a variety of marketing and leadership positions at Clarity Visual Systems, General Electric, Rumblefish, and Planar Systems.
I-Connect007 publisher Barry Matties commented, “We are extremely pleased to welcome Nolan to the I-Connect007 team. Our reputation for providing high-quality original content to our readers is a direct reflection of the strength of our team and contributors. By adding Nolan and his vast industry experience, our team is now that much stronger.”
Nolan graduated from Oregon State University with a degree in computer science, but a close inspection of his college transcript will show nearly all his elective courses were English, literature, and writing courses—the result of a lifelong love for journalism, creative writing, and storytelling. The combination of his love of both science and literature make him a perfect fit for the I-Connect007 editorial team.
When asked about his new position, Nolan remarked, “I-Connect007's stable of publications continue to lead the industry conversation with detailed insight, news and customer stories that readers want to share. With so much change in the electronics manufacturing industry right now, there certainly are plenty of stories to tell and we are telling them every single day. I couldn't be more excited to join this great team.”
When not at work, Nolan enjoys spending time with his wife, their cadre of rescue pets, and their grown children. In addition to reading voraciously, his hobbies include sailing, learning celestial navigation, home restoration, and attempting to play the guitar. Look for his musical debut on stage at IPC APEX EXPO 2019, alongside Design007 editor Andy Shaughnessy and a cast of other well-known industry faces.
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Rachael Temple - AlltematedSuggested Items
Mexico's Moment in Electronics Manufacturing
11/12/2025 | Lorena Villanueva, Global Electronics Association MexicoOn a weekday morning in the Bajío, Mexico, a training lab reviews accept/reject criteria before a line changeover. By mid-afternoon, a cross-border shipment clears in El Paso that left Ciudad Juárez at dawn. Farther south, a university team finalizes intake for a new electronics pathway blending online modules with factory practicums. These scenes—routine yet transformative—explain whyMexico is becoming the most strategic partner for the United States to ensure a resilient, innovative, and sovereign electronics supply chain in North America.
MacDermid Alpha Electronics Solutions to Feature an Integrated Materials Platform Engineered for Long-Term Reliability at Productronica
11/12/2025 | MacDermid Alpha Electronics SolutionsEvery advancement in electronics raises expectations for enhanced performance and environmental stewardship. Meeting these challenges demands materials engineered for reliability and developed to support sustainable manufacturing. Industry momentum across connected devices, high-reliability automotive electronics, and rapidly increasing compute density is elevating the role of materials selection as a core driver of long-term system performance.
Advanced Electronics Packaging Digest: Third Issue Arrives November 17
11/12/2025 | I-Connect007The third issue of Advanced Electronics Packaging Digest launches Monday, November 17. This issue continues AEPD’s mission to deliver forward-looking analysis and insider perspectives on the technologies reshaping advanced electronics packaging. Among the highlights is a review of IMPACT 2025, where discussions on component-to-system-level integration took center stage as experts explored the challenges and breakthroughs driving advanced packaging technologies.
Questex Refocuses Fierce Electronics Brand to Fierce Sensors
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San Francisco Startup Tuurny Builds AI Robot to 'Mine' Electronic Waste for Critical Chips
11/12/2025 | Globe NewswireA San Francisco startup Tuurny announced it is developing a platform that solves world’s two massive, contradictory problems: a critical shortage of computer chips and a growing mountain of electronic waste.