-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Benchmark Facilities Earn MedAccred Accreditation
August 14, 2018 | PRNewswireEstimated reading time: 2 minutes
In recognition of its compliance with the rigorous requirements for printed circuit board assembly and quality systems established by the Performance Review Institute (PRI) and a consortium of OEM medical device manufacturers, Benchmark Electronics announced that its Minnesota facilities in Rochester and Winona have received MedAccred Printed Circuit Board accreditation. The Benchmark facilities are the first in Minnesota and the second and third facilities in North America to receive this accreditation.
The MedAccred accreditation program, formed in 2010 by the PRI, was designed to reduce risk to patient safety and assure quality products and compliance with requirements as they apply to critical manufacturing processes used in the production of medical devices. Through the oversight of providers, the program addresses many of the challenges posed by today's global, multi-tiered supply chain.
"The MedAccred Printed Circuit Board Assembly accreditation is a testament to our team's experience, dedication and leadership in the medical technology industry, which we have served since 1979," said Paul Tufano, president and CEO, Benchmark. "Our passion for innovation incorporates the latest technologies for our customers while ensuring the most stringent quality and regulatory guidelines."
"The MedAccred program establishes stringent industry-consensus audit criteria that incorporates robust industry standards and OEM requirements," said Joe Pinto, executive vice president and chief operating officer, PRI. "Companies such as Benchmark work hard to obtain this status and they should be justifiably proud of it. Holding an accreditation is irrefutable evidence that a company is operating at the highest level and clearly demonstrates its commitment to both quality and safety."
About Benchmark Electronics, Inc.
Benchmark provides worldwide integrated electronics manufacturing services (EMS), engineering and design services, innovative technology solutions and precision machining services to original equipment manufacturers in the following industries: industrial controls, aerospace and defense, telecommunications, computers and related products for business enterprises, medical devices, and test and instrumentation. Benchmark's global operations include facilities in seven countries, and its common shares trade on the New York Stock Exchange under the symbol BHE.
About MedAccred
MedAccred is an industry managed supply chain oversight program that reduces risk to patient safety, assures quality products and compliance with requirements as they apply to critical processes used in the production of medical devices. The program is administered by the not-for-profit Performance Review Institute. PRI is a global provider of customer-focused solutions designed to improve process and product quality by adding value, reducing total cost and promoting collaboration among stakeholders in industries where safety and quality are shared goals. PRI works closely with industry to understand their emerging needs and offers customized solutions in response.
Suggested Items
Moog Announces Acquisition of COTSWORKS
07/07/2025 | BUSINESS WIREMoog Inc., a worldwide designer, manufacturer and systems integrator of high-performance precision motion and fluid controls and control systems, announced the acquisition of COTSWORKS Inc., an aerospace and defense fiber optics transceiver component manufacturer, for a purchase price of $63 million.
S&K Aerospace Awarded Major Contract Under DLA Maritime Acquisition Advancement Program
07/02/2025 | BUSINESS WIRES&K Aerospace, LLC has been awarded a significant contract under the Defense Logistics Agency’s (DLA) Maritime Acquisition Advancement Program, managed by the U.S. Naval Supply Command - Weapon Systems Support (NAVSUP WSS) in Mechanicsburg, PA.
Green Circuits to Exhibit Full-Service Electronics Manufacturing Solutions at 2025 SMD Symposium
07/02/2025 | Green CircuitsGreen Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, is pleased to announce its participation in the 2025 SMD Symposium, taking place August 5-7 at the Von Braun Center in Huntsville, Alabama.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/27/2025 | Nolan Johnson, I-Connect007While news outside our industry keeps our attention occupied, the big news inside the industry is the rechristening of IPC as the Global Electronics Association. My must-reads begins with Marcy LaRont’s exclusive and informative interview with Dr. John Mitchell, president and CEO of the Global Electronics Association. For designers, have we finally reached the point in time where autorouters will fulfill their potential?
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.