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Traditional Materials, High-Frequency Boards?

06/18/2024 | I-Connect007 Editorial Team
Not long ago, high-frequency and RF boards required specialized laminates, which tend to be costly and difficult to manufacture. But now, high-frequency designers use traditional PCB laminates for certain high-frequency boards. How is this possible? For some insight, we asked Ed Kelley, founder of Four Peaks Innovation and former CTO of Isola, to discuss how traditional materials have improved and what this means to PCB designers and design engineers today.

Rogers Expands Capabilities and Services With New Application Laboratory

06/12/2024 | Rogers Corporation
Rogers Corporation announced that the new application laboratory was completed, expanding the company's assembly, testing and inspection capabilities and services at the curamik® production site in Eschenbach.

Book Excerpt: The Printed Circuit Assembler’s Guide to... Encapsulating Sustainability for Electronics

06/12/2024 | I-Connect007 Editorial Team
Encapsulation resins are ruggedizing solutions for challenging environments. There are several different options available, and it is possible to segment them in many ways, including chemistry type, cure method, or end application. This book is written as an introductory guide to aid the reader in understanding these encapsulation resins. It should act as a tool for application troubleshooting, taking an in-depth look at specific test methods and their relevance to key industries. What follows is an excerpt from Chapter 1.

Quantic Electronics Expands Global Footprint with Powell Electronics Distribution Deal

06/10/2024 | Quantic Electronics
Quantic® Electronics ("Quantic"), a portfolio company of Arcline Investment Management, today announced it has entered into a global distribution agreement with Powell Electronics for its US-based capacitor businesses, including Quantic™ Evans, Quantic™ Eulex, Quantic™ Paktron, and Quantic™ UTC. These businesses develop and manufacture reliable capacitors for mission-critical defense, aerospace, space, communications, and industrial applications.

Indium to Feature Precision Gold-Based Die-Attach Preforms at International Microwave Symposium

06/05/2024 | Indium Corporation
Indium Corporation® will feature its high-reliability, gold-based precision die-attach (PDA) preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, Washington, D.C., June 18-20.
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