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Jaltek Forge Partnership to Target New ‘Agritech’ Business

07/26/2024 | Jaltek
Jaltek is thrilled to announce it has signed a new partnership that will give ‘agritech’ innovators seeking contract manufacturing and electronics solutions a single point of contact.

iNEMI Packaging Tech Topic Webinar: Equipment Capabilities and Challenges to Support Advanced Packaging Trends

07/26/2024 | iNEMI
Modern day computing needs, notably AI/machine learning and high-performance computing, along with their subsequent memory and I/O requirements, are fueling an increased demand for semiconductor devices with higher performance, lower power consumption and latency as well as reduced footprint.

Ventec Giga Solutions & Hi-Print Team up to Launch World's First 3-Color Inkjet Printing Solution

07/24/2024 | Ventec International Group
Ventec Giga Solutions, Ventec’s value-added PCB equipment division, and leading inkjet printer manufacturer Hi-Print have teamed up to launch the industry’s most cutting-edge inkjet printer for solder mask technology.

Dymax Expands Core Market Focus to Include the Energy Sector

07/24/2024 | Dymax
Dymax, a leading manufacturer of rapid curing materials and equipment, announces a curated lineup of light-curable adhesives and coatings designed to meet the complex assembly needs of stationary energy storage systems such as industrial gas turbines (IGTs) and various types of fuel cells and electrolyzers including Solid Oxide (SOFC) and Proton Exchange Membrane (PEMFC).

BOOK EXCERPT: The Printed Circuit Assembler’s Guide to... Encapsulating Sustainability for Electronics, Chapter 3

07/24/2024 | I-Connect007 Editorial Team
This chapter provides an in-depth analysis of general-purpose and specialist encapsulation resins for electronic applications. Also covered are properties, testing methods, suitability for harsh environments, and thermal management of high-power density electronic devices.
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