-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Xcerra Launches New Options for the MT2168 XT
September 4, 2018 | Xcerra Corp.Estimated reading time: 1 minute

Xcerra has added two new optional features to the MT2168 XT pick-and-place handler. Both options target optimization of test floor processes, allowing the customer to deliver enhanced quality. The double device detection (DDD) option increases binning integrity; the automatic temperature calibration enables the customer to meet quality standards by calibrating as scheduled without time consuming manual processes.
The double device detection is based on a teachable feature, which checks the socket for emptiness before the next package will get plunged. The optical distance check with laser is based on hardware additions on the handler only and does not require any modification to the socket. Based on the distance measurement the double device detection of the MT2168 is also applicable for ultra-thin packages, which is not usually the case using alternative empty check methods.
The automatic temperature calibration is based on optional measurement equipment and is controlled by the handler software directly. During the full calibration process no human interactions are required, which has substantial impact on resource efficiency and process quality.
”Both options significantly contribute to the test floor performance and process quality. The Double Device Detection deploys an innovative principle, which makes it superior to other solutions. With the automatic temperature calibration, the MT2168 enables our customers to fulfill the requirements of their quality standard, while saving a significant amount of time and effort, which would usually keep his onsite resources busy for several hours,” says Andy Ludwig, product manager.
About Xcerra
Xcerra is comprised of two reporting segments; semiconductor test solutions (STS) and electronics manufacturing solutions (EMS). The STS segment supplies semiconductor testers, test handlers, device contactors and associated services. The EMS segment offers products and services for PCB and PCBA test as well as innovative and highly reliable interconnect components for electronic manufacturing. The combination of these businesses creates a Company with a broad spectrum of semiconductor and PCB test expertise that drive innovative new products and services, and the ability to deliver to customers fully integrated semiconductor test cell solutions. The Company’s products and services address the broad and divergent requirements of the mobility, automotive, industrial and consumer end markets, offering a comprehensive portfolio of solutions and technologies, and a global network of strategically deployed applications and support resources. Additional information can be found here.
Suggested Items
Meet the Author Podcast: Martyn Gaudion Unpacks the Secrets of High-Speed PCB Design
07/10/2025 | I-Connect007In this special Meet the Author episode of the On the Line with… podcast, Nolan Johnson sits down with Martyn Gaudion, signal integrity expert, managing director of Polar Instruments, and three-time author in I-Connect007’s popular The Printed Circuit Designer’s Guide to... series.
TTCI Joins Printed Circuit Engineering Association to Strengthen Design-to-Test Collaboration and Workforce Development
07/09/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is proud to announce its membership in the Printed Circuit Engineering Association (PCEA), further expanding the company’s efforts to support cross-functional collaboration, industry standards, and technical education in the printed circuit design and manufacturing community.
Study on Resonance Mitigation in Metallic Shielding for Integrated Circuits
07/08/2025 | Maria Cuesta-Martin, Victor Martinez, Vidal Gonzalez Aguado, Würth ElektronikInherent cavity resonant modes often lead to significant degradation of shielding effectiveness, responsible for unwanted electromagnetic coupling. Cavity resonant modes of the metal shielding enclosure can produce two adverse problems: the mutual coupling among different RF modules and shielding effectiveness reduction of the metal enclosure. The cabinets serve to shield certain components from electromagnetic interference (EMI). However, these cavities present some resonance peaks at 5 GHz, making it impossible to use them at higher frequencies.
The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
07/02/2025 | Global Electronics AssociationThe Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.
Magnalytix and Foresite to Host Technical Webinar on SIR Testing and Functional Reliability
06/26/2025 | MAGNALYTIXMagnalytix, in collaboration with Foresite Inc., is pleased to announce an upcoming one-hour Webinar Workshop titled “Comparing SIR IPC B-52 to Umpire 41 Functional & SIR Test Method.” This session will be held on July 24, 2025, and is open to professionals in electronics manufacturing, reliability engineering, and process development seeking insights into new testing standards for climatic reliability.