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ERAPSCO Allowed to Participate at US Navy Production Sonobuoy Bid Process
September 6, 2018 | Sparton Corp.Estimated reading time: 1 minute
The United States Navy has taken corrective action to reopen the competitive range regarding Solicitation No. N00010-19-R-002 for the GFY19-23 AN/SSQ-125A (Q-125A) production sonobuoy and include ERAPSCO in that competitive range. This allows ERAPSCO— a joint venture between Sparton DeLeon Springs LLC, a wholly-owned subsidiary of Sparton Corp., and Undersea Sensor Systems Inc., a wholly-owned subsidiary of Ultra Electronics Holdings plc—to again participate in the bid process.
On July 9, 2018, Sparton filed a bid protest by ERAPSCO with the United States Government Accountability Office (GAO) and requested that the GAO restore ERAPSCO’s ability to participate in the bid process. As a result of the Navy’s decision to restore ERAPSCO’s ability to participate in the bid process, on September 4, 2018 the GAO dismissed the protest.
About Sparton
Sparton Corporation (NYSE:SPA), now in its 119th year, is a provider of complex and sophisticated electromechanical devices with capabilities that include concept development, industrial design, design and manufacturing engineering, production, distribution, field service and refurbishment. The primary markets served are Medical & Biotechnology, Military & Aerospace and Industrial & Commercial. Headquartered in Schaumburg, Illinois, Sparton currently has thirteen manufacturing locations and engineering design centers worldwide. Sparton’s Web site may be accessed at www.sparton.com.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/27/2025 | Nolan Johnson, I-Connect007While news outside our industry keeps our attention occupied, the big news inside the industry is the rechristening of IPC as the Global Electronics Association. My must-reads begins with Marcy LaRont’s exclusive and informative interview with Dr. John Mitchell, president and CEO of the Global Electronics Association. For designers, have we finally reached the point in time where autorouters will fulfill their potential?
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.