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New Breakthrough in Double-Sided Reflow Part Retention from Alltemated

07/19/2024 | Alltemated
Alltemated's PLACE-N-BOND™ underfilm passed testing and was implemented in volume production to aid in component retention during the second pass reflow of printed circuit assemblies. This successful testing and implementation occurred in various applications with components such as capacitors, inductors, transformers, connectors, and larger ICs.

Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics, Chapter 2

07/17/2024 | I-Connect007 Editorial Team
In this chapter, we’ll focus on the most important analytics at the forefront of SMT, from the solder paste machine to placement machines, and breakdown these metrics from the perspectives of the different decision makers involved in the process. The lead SMT shift manager isn’t going to have the same concerns as a quality manager, so it’s important to look at how each machine and operation contains valuable KPIs for each role.

SMTA Heartland Chapter Announces Rescheduled Date for High Reliability: Virtual STAR Forum

07/10/2024 | SMTA
The SMTA Heartland Chapter announces the rescheduled date for the High Reliability: Virtual STAR Forum, following the overwhelming success of our May event. Join us on Tuesday, July 30, 2024, for an afternoon of engaging discussions and expert insights into high-reliability manufacturing.

Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 2

07/10/2024 | I-Connect007 Editorial Team
The evolution of low-temperature solder alloys requires thoughtful consideration of the thermal and mechanical reliability requirements specific to each application. Thermal cycling and drop (mechanical) shock tests have long been used as board-level proxy tests for evaluating and quantifying the ability of electronics assemblies to sustain abrupt, short-term mechanical stresses, as well as continuous cyclic stresses.

Mek Introduces ISO-Spector S3 Series: New Feature-Rich 5D SPI Systems Offering Unmatched Value

07/08/2024 | Mek (Marantz Electronics)
Mek (Marantz Electronics), a leading innovator in AOI and SPI systems for electronics manufacturing, proudly introduces the new ISO-Spector S3 series 5D Solder Paste Inspection systems.
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