Driving Innovation: Direct Imaging vs. Conventional Exposure
It’s Only Common Sense: Selling to Today's Generation of Buyers
Dan’s Biz Bookshelf: ‘Believe in Better'
Alun Morgan Named Technology Ambassador for Ventec
September 19, 2018 | Ventec International GroupEstimated reading time: 1 minute
Ventec International Group Co., Ltd. announced that Alun Morgan, chairman of the EIPC, has been named technology ambassador for Ventec International Group. In support of a common mission to promote the next generation’s progress in PCB material design, Alun will apply his extensive background and expertise in advocating for the Taiwan stock exchange listed company as an advisor and ambassador.
One of Alun's first public appearances in his new role as Technology Ambassador for Ventec will be at the 11th CTI Symposium in Munich (November 22-23, 2018) with a presentation titled 'Hot Cars, cool electronics… Thermal Management Materials for Automotive Electronics'.
Alun continues to serve as the chairman of The European Institute for the PCB Community (EIPC) and holds the posts of director and trustee of the charity Scottish Autism.
He began his career as a research investigator at the Institute of Physics' Fulmer Research Institute in the UK and after serving as technical manager of a PCB manufacturer, he joined PCB materials supplier MAS Electronics going on to become UK general manager. Following the acquisition of MAS by Isola, he joined the Isola management team serving as a director and corporate vice-president of Operations and Engineering of the Isola Group worldwide.
Alun holds a B.Sc. Honors degree in Metallurgy from the Department of Materials Science and Engineering at the University of Surrey, is an associate of the University of Surrey and a Fellow of the Institute of Circuit Technology.
"I am excited to work with an organization whose strong reputation and global recognition as a leading materials supplier is built upon its innovative culture and unique & proven product development capabilities," said Alun of his new role.
"I can't think of a more perfect ambassador for Ventec than Alun. He is highly networked & respected in the industry and widely acknowledged as a PCB expert. His experience and entrepreneurial flair will be of great benefit to Ventec as we journey through our most exciting period of development for the Group," Mark Goodwin, Ventec's COO Europe and Americas, added.
About Ventec International Group
With volume manufacturing facilities and Headquarters in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, click here.
Share on:
Suggested Items
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.