-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Altus Manages Miniaturisation Growth with 3D AOI Technology
September 26, 2018 | Altus GroupEstimated reading time: 1 minute

The use of AOI systems is a popular method of inspection, especially in today’s increasing use of microelectronics. The growth in miniaturisation requires state-of-the-art techniques and inspection methods to ensure circuitry runs as it should. This however is becoming progressively difficult due to the increasing use of very complex and intricate PCBs. 3D AOI inspection is answering this call and Altus Group, a leading distributor of capital equipment, has seen a substantial increase in its popularity.
3D AOI is the automated visual inspection of PCB manufacture which uses a camera to scan the assembly for defects that would lead to board failure. It can be used at many stages through the manufacturing process including bare board inspection, solder paste inspection and populated board inspection (pre and/or post reflow).
“As technology progresses and PCBs decrease in size, we are receiving many more enquiries for 3D AOI equipment which present meaningful data to our customers. More manufacturers are adopting 3D AOI to increase board quality. Measurement data generated from 3D AOIs provides an insight on the process and helps eliminate the root causes of a defect in a PCB.
“One of the most popular systems from our portfolio is Koh Young’s Zenith 3D AOI. Based on their innovative technology ‘Zenith’ it measures the true profilometric shape of components, solder joints, patterns and even foreign material on assembled PCBs with patented 3-dimensional measurement, overcoming the shortcomings and vulnerabilities of traditional 2D AOI. A great asset to any modern PCB manufacturing facility.
“We have delivered over 100 inspection systems in the UK and this figure is growing rapidly due to the importance of true 3D inspection. The challenges and limitations of optical inspection systems can no longer be overlooked, because they can be the cause for false calls and escapes. The growth of innovative high-tech inspection equipment will continue to increase in popularity. We are ready for this demand with equipment and engineers in place to provide the best possible service and advice,” said Matthew Jones, sales director at Altus.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.