-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueDon’t Just Survive, Thrive
If we are to be relevant and prosper during these next critical decades in electronics, we must do more than survive. As an industry, we can and must thrive. In this issue, our contributors explore these concepts meant to help you take your business to the next level.
Material Matters
Materials management is nuanced, multifaceted, and requires a holistic systems approach for business success. When building high mix, low volume, and high technology, managing materials and overall cost containment are even greater challenges.
Additive Manufacturing
In this month’s issue, we explore additive manufacturing technology for the PCB fabricator: where it stands today, the true benefits, and where it seems to be headed.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Aspocomp Raises Outlook for Net Sales and Operating Result in 2018
October 16, 2018 | AspocompEstimated reading time: 1 minute
Aspocomp Group Plc upgrades its outlook for full-year 2018 net sales and operating result. In 2018, net sales are expected to grow approximately 15% compared with 2017 and the operating result to be approximately EUR 2 million. In 2017, net sales amounted to EUR 23.9 million and the operating result to EUR 0.8 million.
Customer demand is expected to grow stronger than earlier estimated during the rest of the year.
In its previous outlook for 2018 (issued on July 30, 2018), Aspocomp estimated that its net sales would grow over 10% and the operating result would double compared with 2017.
Aspocomp’s interim report for the period January 1 – September 30, 2018 will be released on Thursday, October 25, 2018.
About Aspocomp
A printed circuit board (PCB) is used for electrical interconnection and as a component assembly platform in electronic devices. Aspocomp provides PCB technology design, testing and logistics services over the entire lifecycle of a product. The company’s own production and extensive international partner network guarantee cost-effectiveness and reliable deliveries.
Aspocomp’s customers are companies that design and manufacture telecommunication systems and equipment, automotive and industrial electronics, and systems for testing semiconductor components for security technology. The company has customers around the world and most of its net sales are generated by exports.
Aspocomp is headquartered in Espoo and its plant is in Oulu, one of Finland’s major technology hubs.
Suggested Items
Intel Names Naga Chandrasekaran to Lead Foundry Manufacturing and Supply Chain
07/26/2024 | IntelIntel Corporation today announced the appointment of Dr. Naga Chandrasekaran as chief global operations officer, executive vice president and general manager of Intel Foundry Manufacturing and Supply Chain organization.
We Energies, Foxconn Complete Clean Energy Project in Wisconsin
07/25/2024 | FoxconnWe Energies, a Wisconsin-based utility company of WEC Energy Group, and Hon Hai Technology Group (Foxconn) are pleased to announce the completion of a solar panel installation project at Foxconn’s Science and Technology Park in Mount Pleasant, Wisconsin.
Pragmatic Semiconductor Appoints Murthy Renduchintala to Board of Directors
07/25/2024 | PRNewswirePragmatic Semiconductor Ltd. announced the appointment of Dr. Venkata "Murthy" Renduchintala, as a non-executive director to Pragmatic's Board of Directors, effective immediately.
Altair Signs MoU With University of Nottingham to Develop Aerospace Digital Twin Project
07/25/2024 | PRNewswireAltair, a global leader in computational intelligence, has signed a memorandum of understanding (MoU) with the U.K.-based University of Nottingham for a digital twin project within the aerospace sector.
MKS’ Atotech and ESI Participate in Electronics Circuit Asia in Thailand
07/25/2024 | AtotechMKS Instruments announces its participation at the Electronics Circuit Asia 2024 in Thailand, July 24-26, highlighting its leading brands Atotech® and ESI® and related advances in advanced packaging, package substrate, and printed circuit board manufacturing.