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Indium to Feature Thermal Interface Materials at Thermal Management Workshop
October 24, 2018 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation will feature its metallic thermal interface materials (TIMs) at the Advanced Technology Workshop on Thermal Management, November 6-8 in Los Gatos, California.
Indium Corporation’s metallic TIMs are easy to handle and rework. These products provide higher thermal conductivity as compared to polymer-based TIMs, making them ideal for die-attach, burn-in and test, IGBT applications, and almost any application where high performance thermal materials are required.
Metallic TIMs can be used as either a solder or compressible material:
- Solder TIMs, such as Solder Preforms, reflow and melt to form a mechanical bond
- Compressible TIMs, such as Heat-Spring® or non-reflow metals, like Liquid Metal, do not require heat and support temperature-sensitive applications
Indium Corporation’s metallic TIMs can be custom-made to your specifications with a variety of materials based on your product or process needs and include Pb-free options.
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, click here.
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