Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Alpha Launches Ultra-Low Voiding Solder Paste for Vacuum Solder Reflow
December 12, 2018 | Alpha Assembly SolutionsEstimated reading time: Less than a minute
Alpha Assembly Solutions has recently introduced ALPHA OM-355, designed specifically for vacuum soldering applications.
“Inline vacuum soldering capabilities are becoming more common as power density increases on BGAs and as BTC component packages require effective heat dissipation through void reduction”, said Paul Salerno, global portfolio manager for SMT Solutions at Alpha Assembly Solutions. “This solder paste has an activator system that is optimized for the vacuum soldering reflow process to control the rate of volatilization and reduction in surface tension which allows voids to escape under reducing atmosphere. This promotes ultra-low voiding below 5% without the post-reflow defects commonly associated with vacuum soldering.”
Part of Alpha’s Void Reduction Solutions, ALPHA OM-355 is compatible with SAC305, Innolot and MAXREL Plus alloys.The ALPHA OM-355 MAXREL Plus solder paste is intended for final assemblies in automotive, defense, aerospace, telecommunications, or any device requiring power management and high reliability.
Share on:
Suggested Items
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/15/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
SHENMAO Strengthens Semiconductor Capabilities with Acquisition of PMTC
07/10/2025 | SHENMAOSHENMAO America, Inc. has announced the acquisition of Profound Material Technology Co., Ltd. (PMTC), a premier Taiwan-based manufacturer of high-performance solder balls for semiconductor packaging.
KYZEN to Highlight Understencil and PCB Cleaners at SMTA Querétaro Expo and Tech Forum
07/09/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Querétaro Expo & Tech Forum, scheduled to take place Thursday, July 24, at Centro de Congresos y Teatro Metropolitano de Querétaro.
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.