Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
Dan’s Biz Bookshelf: ‘Growth Hacker Marketing’
Happy’s Tech Talk #38: Novel Metallization for UHDI
Ventec Extends tec-speed 20.0 Series of Low PIM Antenna-Grade Laminates
December 13, 2018 | Ventec International GroupEstimated reading time: 1 minute
Ventec International Group Co., Ltd. has added four new low passive intermodulation (PIM) antenna-grade laminates to its tec-speed 20.0 ceramic-filled hydrocarbon thermoset material series. These latest additions combine unrivaled high-frequency performance (Dk 3.00-3.48 / Df 0.002-0.0037), superior loss characteristics and the highest reliability with fast availability and efficient delivery through Ventec’s fully controlled and managed global supply chain and technical support-network.
No More Compromises—Performance, Price & Availability
The tec-speed 20.0 series, which is designed for the world's most demanding high frequency Printed Circuit Board applications, has now been extended with four new low PIM antenna-grade laminates: L300, L330, L340 and H348. These ceramic-filled, hydrocarbon thermoset materials offer excellent dimensional stability and uniform mechanical properties that help limit PIM.
Preserving signal integrity up to high-GHz frequencies, dielectric constant (Dk) specifications range from 3.0 to 3.48 at 10GHz and dissipation factor (Df) from 0.0025 to 0.0037 at 10 GHz giving customers a choice of the most effective material for their design. All four new materials offer first-rate processability, unrivaled RF characteristics and excellent thermal conductivity values that are ideally suited to cope with the heat generated by high-power levels. Most notable are the outstanding PIM levels of ≦-160 dBc and UL-V0 Flammability rating for the entire series.
With tec-speed 20.0, Ventec has responded to customer demands for high-performance, reliable and cost-efficient high frequency materials that are supported by a fast and efficient global delivery promise and dependable technical support.
tec-speed 20.0 ceramic-filled hydrocarbon thermoset materials are manufactured by Ventec using strict quality-controlled processes that are certified to AS9100 Revision D, ISO/TS16949 and ISO 9001:2015, and, like all Ventec products, are backed by a fully controlled and managed global supply chain, sales- and technical support-network.
Visit I-007eBooks to download your copy of Ventec micro eBook today:
The Printed Circuit Designer's Guide to...Thermal Management with Insulated Metal Substrates
Share on:
Suggested Items
Taiwan's PCB Industry Chain Is Expected to Grow Steadily by 5.8% Annually in 2025
05/05/2025 | TPCAAccording to an analysis report jointly released by the Taiwan Printed Circuit Association (TPCA) and the Industrial Technology Research Institute's International Industrial Science Institute, the total output value of Taiwan's printed circuit (PCB) industry chain will reach NT$1.22 trillion in 2024, with an annual growth rate of 8.1%.
New Database of Materials Accelerates Electronics Innovation
05/05/2025 | ACN NewswireIn a collaboration between Murata Manufacturing Co., Ltd., and the National Institute for Materials Science (NIMS), researchers have built a comprehensive new database of dielectric material properties curated from thousands of scientific papers.
DuPont Exceeds Quarterly Profit Expectations as Electronics Segment Benefits from Semiconductor Demand
05/05/2025 | I-Connect007 Editorial TeamDuPont reported higher-than-expected earnings for the first quarter of 2025, supported by increased demand in its electronics and industrial segments. The company’s adjusted earnings per share came in at 79 cents, surpassing the average analyst estimate of 65 cents per share, according to data from LSEG.
SEMICON Europa 2025 Call for Abstracts Opens for Advanced Packaging Conference and MEMS & Imaging Summit
05/05/2025 | SEMISEMI Europe announced the opening of the call for abstracts for SEMICON Europa 2025, to be held November 18-21 at Messe München in Munich, Germany. Selected speakers will share their expertise at the Advanced Packaging Conference (APC), MEMS & Imaging Sensors Summit, and during presentations on the show floor.
New Database of Materials Accelerates Electronics Innovation
05/02/2025 | ACN NewswireIn a collaboration between Murata Manufacturing Co., Ltd., and the National Institute for Materials Science (NIMS), researchers have built a comprehensive new database of dielectric material properties curated from thousands of scientific papers.