Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Challenges in Flex Circuit Assembly
December 19, 2018 | I-Connect007 Research TeamEstimated reading time: Less than a minute
In a recent I-Connect007 survey on flex circuits, we asked the following question: What are some of the challenges that you face utilizing flex circuits? Here are just a few of the replies, edited slightly for clarity.
Jana Carraway, MicroSystems Engineering Inc.: "IPC standards do not represent Class 3 medical implant technology; base materials are limited for implantable materials; and high-end technology is treated as consumable when it takes significant quality and reliability systems to fab reliable product."
Anton van Achteren, Major Electronics: "Materials, such as rigid support, to get a correct support when components are being placed; good reflow profile—flex materials deform easily, and that is something that must be controlled to get good soldering of the components."
Dennis Fritz, SAIC Inc.: "Limited number of suppliers for the rigid/flex defense circuits we design; and delay in supply due to materials shortages."
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