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Global PCB Market to Witness a CAGR of 4.2% during 2018-2024
January 3, 2019 | Globe NewswireEstimated reading time: 1 minute
The global printed circuit board (PCB) market was valued at $60.42 billion 2017 and is expected to reach $80.38 billion by 2024, at a CAGR of 4.2%. Factors driving the growth of the market are: rising adoption of automation in various end-user industries, growing demand for wireless devices, increasing miniaturization of devices, surging need for more efficient interconnect solutions, and rapid growth in flexible circuits. Owing to the implementation of processors and sensors in smart gadgets, the size of the PCB has reduced to 74%. Additionally, usage of flame retardant chemicals in PCBs to ensure fire safety, and increasing capital investment is further augmenting the market growth. Moreover, huge growth in global PCB market is also led by the increasing demand for smart tablets and smart phones in IT and consumer electronics sector. Growth in wearable electronics is emerging as a key opportunity in the growth of the global PCB market.
Printed circuit board is a circuit board in which a thin layer of copper is laminated, that offers an interconnection to the electronic components. To place electronic components on the insulated board, holes are created with the help of drillers. Further, components are mounted on the PCBs and soldering is done to fix the electronic components in a specified area. It provides a support to the electronic components and the electrical connection carrier. PCBs are used to electrically connect the components and provide a base.
With the rapid development in technology, electronics products will continue to emerge. But, massive production of PCB is becoming unfriendly to environment, due to the usage of wet chemicals while manufacturing. Moreover, lack of recycling ability also degrades the adoption rate of printed circuit boards. And to ensure less toxic emissions into the environment, ink jet printing technology is invented. This technology enables the cost-effective manufacturing of thin, flexible and disposable electrical devices. Moreover, Taiwan-based manufacturer (Wistron) is also looking to relocate a PCB manufacturing plant in Bengaluru, and has invested about $1 billion.
Global Printed Circuit Board (PCB) Market - Regional Insight
Geographically, the global printed circuit board market is segmented in Asia-Pacific, North America, Europe, and Rest of the World. Asia-Pacific is dominating the global PCB market in 2017 (77%), followed by North America. The growth in APAC region is attributed to the presence of many semi-conductor manufacturers, growing adoption of smart devices. North America is expected to hold the second largest market during the forecast period.
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NVIDIA Architecture Drives Optical Interconnects; CPO in AI Data Centers Rising
03/11/2026 | TrendForceNVIDIA’s next-generation AI compute rack architecture indicates that future GPU designs will increasingly prioritize higher chip-to-chip interconnect density and faster data transmission, according to TrendForce’s latest research on the high-speed interconnect market.
Powering the Future: How Packaging Choices Make or Break Performance
03/11/2026 | Brian Buyea -- Column: Powering the FutureWhen we talk about reliability in electronics, we often focus on the system level: redundancy, fail-safes, or software resilience. But long before the system is assembled or even tested, reliability is considered in materials, metallization, and the packaging process itself. If the foundation isn’t built to survive the environment, no amount of clever design downstream will make up for it.
NCAB Group White Papers: Practical PCB Design Guidance for Manufacturable Results
02/25/2026 | I-Connect007 Editorial TeamThe I-Connect007 Industry Resource Center brings together expert white papers that help engineers and manufacturers navigate today’s design and manufacturing challenges across the PCB lifecycle. NCAB Group contributes a valuable collection of white papers focused on practical PCB design and manufacturability. Drawing on their experience with a global network of production partners, NCAB helps engineers align design intent with fabrication realities: reducing risk while improving consistency and long-term reliability.
Connect the Dots: Designing for the Future of Manufacturing Reality—Strip-Etch-Strip
02/19/2026 | Matt Stevenson -- Column: Connect the DotsThe demand for ultra-high density interconnect (UHDI) PCBs is growing as electronic devices become increasingly advanced. That means we will be creating more designs that need to align with the reality of manufacturing UHDI boards. My last column on this subject focused on plating, and we are ready to discuss the strip-etch-strip (SES) process. With UHDI boards, footprints are smaller and tolerances are tighter. Your big design challenge associated with the SES process involves trace width and spacing control. The etching process can undercut traces and alter their final size.
Powering the Future: From Thick-Film to DBC—Understanding the Evolution of Ceramic Packaging
02/11/2026 | Brian Buyea -- Column: Powering the FutureCeramic packaging has quietly powered the electronics revolution for more than half a century. From the earliest thick-film hybrids to today’s direct bond copper (DBC) substrates and metallized aluminum nitride, every step forward in ceramic technology has pushed the limits of reliability, power density, and performance. It’s essential for every design engineer building the next generation of electronic systems to understand this evolution.