-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
The Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Koh Young to Demo Hermes and CFX Lines at IPC APEX EXPO 2019
January 24, 2019 | Koh Young TechnologyEstimated reading time: 2 minutes

Koh Young Technology is globally recognized as a leader in the effort to rapidly implement Industry 4.0 solutions that help manufacturers realize a smart factory. To that end, it is a proudly sponsoring both live production lines demonstrating the HERMES standard (IPC-9852) and IPC's Connected Factory eXchange (CFX) IoT messaging standard (IPC-2591) at the IPC APEX Expo in San Diego during January 28-31, 2019.
Creating the next generation of digital Industry 4.0 technology standards, IPC will again take a major step forward at IPC APEX EXPO 2019, featuring two live production lines, located in the Sails Pavilion, at which visitors can see and experience achievements made in digital standards development over the past year. Both lines feature machines from different vendors, including Koh Young SPI (Solder Paste inspection) and AOI (Automated Optical Inspection) solutions. Each machine in the line all speak the same language, which creates demonstrable value from machine-to-machine communication, creating a practical, smart, and connected manufacturing environment.
The first line includes the Koh Young Zenith AOI system and will feature both the Hermes and CFX IoT standards. The second line includes the Koh Young 8030 SPI system and will also feature the wider application of IPC CFX across multiple technologies of assembly production, including manual processes. These standards and systems work seamlessly together to deliver SMT automation value. Both standards are currently out for ballot and are expected to be approved soon.
“The power of these new industry communication standards is amplified when combined with the Koh Young KSMART software suite, which was designed to help users realize a smart factory,” said Brent Fischthal, IPC-CFX Committee Member and Senior Manager of Americas Marketing at Koh Young. “These standards are helping us deploy our smart factory developments. For example, our Koh Young Process Optimizer (KPO) allows our SPI to automatically adjust print process parameters by exercising complex machine-learning algorithms based on inspection and measurement feedback.” With the help of these standards, as well as its AI algorithms, Koh Young foresees a smart factory solution that can analyze and optimize process parameters across the entire SMT line.
As the absolute leader in 3D inspection market, Koh Young will also take part in several show activities like topical roundtable discussions and interviews on the smart factory and inspection process.
About Koh Young Technology Inc.
Koh Young Technology Inc., the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, machining and assembly process manufacturing, semiconductor manufacturing, and various medical fields. In addition to its corporate headquarters in Seoul, Koh Young has sales and support offices in Germany, Japan, Singapore, China, Mexico, and the United States. These local facilities ensure it sustains a close relationship with its growing customer base, while providing them with access to a global network of inspection and measurement experts.
Suggested Items
KYZEN to Highlight Stencil and Cleaning Solutions at SMTA Monterrey
03/27/2025 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Monterrey Expo & Tech Forum scheduled to take place on Thursday, April 10 at the Cintermex Convention Center in Monterrey, Nuevo León. KYZEN cleaning experts will be on-site highlighting stencil cleaning chemistries KYZEN E5631J and CYBERSOLV C8882.
Indium to Showcase Proven EV Products and High-Reliability Alloys at Productronica China
03/26/2025 | Indium CorporationAs a global materials supplier and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, Indium Corporation® is proud to showcase its high-reliability alloys and soldering solutions at Productronica China, March 26-28, in Shanghai, China.
SolderKing Enhances Brainboxes' Electronics Manufacturing with Expert Support and Advanced Materials
03/26/2025 | SolderKingIn modern electronics manufacturing, success relies on more than high-quality soldering materials. Technical knowledge and process expertise are just as crucial for achieving consistent results. SolderKing, a leading UK manufacturer, provides both, combining advanced consumables with specialist support to help manufacturers optimise their soldering processes.
AIM to Highlight Type 5 Solder and Other Leading Products at SMTA Monterrey Expo & Tech Forum
03/20/2025 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Monterrey Expo & Tech Forum taking place on April 10 at Cintermex in Monterrey, Nuevo Leon, Mexico.
Hentec Industries/RPS Automation to Showcase Valence 2508 at IPC Expo 2025
03/17/2025 | Hentec Industries/RPS AutomationThe Valence 2508 Selective Soldering System is engineered for high-mix, high-volume, advanced PCB production. It supports boards ranging from 25 x 25 mm to 559 x 559 mm (1 x 1 in. to 22 x 22 in.), with a maximum processing area of 508 x 508 mm (20 x 20 in.).