Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Nolan’s Notes: Everyone Has Their Eye on India
Zenaida Valianu, IPC, Earns IPC Excellence in Education Award at IPC APEX EXPO 2025
March 31, 2025 | IPCEstimated reading time: 1 minute
The IPC Excellence in Education award was presented to Zenaida (Zenny) Valianu, IPC, at IPC APEX EXPO 2025, recognizing her significant contributions to workforce development and leadership.
The IPC Excellence in Education award is given to individuals who have significantly contributed to workforce development while building a culture of continuous learning within their organization and across the electronics industry.
Valianu has been a dedicated proponent, practitioner, and innovator of standards and training development for more than 25 years. Recognized for her outstanding leadership of the IPC-J-STD-001 and IPC-7711/7721 training committees, she is a Certified Master Trainer in IPC-J-STD-001, IPC-A-610, IPC-7711/7721, and IPC-A-600. As IPC’s Training Manager, she has dramatically increased the impact of IPC certification programs on the electronics industry.
“IPC is committed to educating and training the electronics industry’s workforce,” said John W. Mitchell, IPC president and CEO. “We are proud to recognize Zenny for her strong leadership and important contributions to workforce development.”
Added Valianu, “As someone who has always valued continuous learning and growth, I find great joy in contributing to the development of others. It is truly rewarding to see our learners succeed and know that our programs played a part in their achievements.”
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/12/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.