-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
IWLPC Tech Committee Unveils 2018 Award Winners
February 5, 2019 | SMTAEstimated reading time: 1 minute
The IWLPC Technical Committee is pleased to announce the Best of Conference, Best Presentation & Best Papers in WLP, 3D, Advanced Manufacturing and Test tracks as chosen by the technical committee and attendees. Papers were evaluated based on technical merit, relevance, originality, knowledge of subject, quality of material, and quality of presentation.
The Best Presentation of Conference was awarded to Robert Hubbard, Ph.D., Lambda Technologies, Inc., for his presentation "Failure Relief in FOWLP Polymer Layers."
Arnita Podpod, IMEC, won Best Paper of Conference for the paper "High Density and High Bandwidth Chip-to-Chip Connections with 20µm pitch Flip-chip on Fan-Out Wafer-Level Package" which also won the Best 3D Track Paper award.
The Best WLP Track Paper went to Jae Cho, Ph.D, GlobalFoundries, for "Chip Board Interaction Analysis of 22-NM Depleted Silicon on Insulator (FD-SOI) Technology in Wafer Level Packaging (WLP)."
The Best Advanced Manufacturing Track Paper was awarded to Habib Hichri, Ph.D., SÜSS MicroTec Inc., for the paper "Fine RDL Formation Using Alternative Patterning Solution for Advanced Packaging."
All papers from the conference proceedings are available in the SMTA Knowledge Base as well as the IEEE Xplore Digital Library. The proceedings can also be purchased in the SMTA Book Store.
About IWLPC
IWLPC brings together the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV and integrated system packaging.
Going into its 16th year, the IWLPC is co-produced by Chip Scale Review, the leading international magazine addressing the semiconductor packaging industry, and SMTA, the distinguished global association representing electronic assembly and manufacturing professionals.
The conference comprises three parallel technical tracks with two full days of presentations on wafer-level packaging, 3D integration, and advanced manufacturing and test. Professional development courses, keynote speakers, and panel discussions are offered by world-class experts and enable attendees to broaden their technical knowledge. The technical program includes a two-day expo where 75 exhibitors showcase their latest technologies and products. The conference provides a collective network of over 800 industry professionals, including vendors from leading semiconductor companies, foundries, and OSATS, as well as key technology, equipment, and materials suppliers in the exhibit area. Attendees will be inspired by the quantity and quality of the featured new developments and emerging technologies. The 16th Annual Conference will be held October 22-24, 2019 in San Jose, California.
Suggested Items
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
07/10/2025 | InfineonAs the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.
TTCI Joins Printed Circuit Engineering Association to Strengthen Design-to-Test Collaboration and Workforce Development
07/09/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is proud to announce its membership in the Printed Circuit Engineering Association (PCEA), further expanding the company’s efforts to support cross-functional collaboration, industry standards, and technical education in the printed circuit design and manufacturing community.
GlobalFoundries to Acquire MIPS to Accelerate AI and Compute Capabilities
07/09/2025 | GlobalFoundriesGlobalFoundries announced a definitive agreement to acquire MIPS, a leading supplier of AI and processor IP. This strategic acquisition will expand GF’s portfolio of customizable IP offerings, allowing it to further differentiate its process technologies with IP and software capabilities.
LITEON Technology Reports Consolidated June Sales of NT$13.6 Billion, Up 16% Y-o-Y
07/08/2025 | LITEON TechnologyLITEON Technology reported its June consolidated revenue of NT$13.6 billion. Thanks to the growth from power management in cloud computing, advanced server, and networking, the revenue is up 2% M-o-M, 16% Y-o-Y. The cumulative sales for January to June totaled NT$76.8 billion, up 24%, Y-o-Y.
Inside Aimtron’s Cross-border EMS Strategy
07/08/2025 | Nolan Johnson, SMT007 MagazineMukesh Vasani immigrated from a very small farming village in India to the U.S. in 1995 as a civil engineer. After shifting into electronics, Mukesh built his Chicago-based company, Aimtron, into a successful enterprise by combining quality with competitive pricing. He leveraged his roots in India to expand manufacturing without compromising on quality.