Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
IWLPC Tech Committee Unveils 2018 Award Winners
February 5, 2019 | SMTAEstimated reading time: 1 minute
The IWLPC Technical Committee is pleased to announce the Best of Conference, Best Presentation & Best Papers in WLP, 3D, Advanced Manufacturing and Test tracks as chosen by the technical committee and attendees. Papers were evaluated based on technical merit, relevance, originality, knowledge of subject, quality of material, and quality of presentation.
The Best Presentation of Conference was awarded to Robert Hubbard, Ph.D., Lambda Technologies, Inc., for his presentation "Failure Relief in FOWLP Polymer Layers."
Arnita Podpod, IMEC, won Best Paper of Conference for the paper "High Density and High Bandwidth Chip-to-Chip Connections with 20µm pitch Flip-chip on Fan-Out Wafer-Level Package" which also won the Best 3D Track Paper award.
The Best WLP Track Paper went to Jae Cho, Ph.D, GlobalFoundries, for "Chip Board Interaction Analysis of 22-NM Depleted Silicon on Insulator (FD-SOI) Technology in Wafer Level Packaging (WLP)."
The Best Advanced Manufacturing Track Paper was awarded to Habib Hichri, Ph.D., SÜSS MicroTec Inc., for the paper "Fine RDL Formation Using Alternative Patterning Solution for Advanced Packaging."
All papers from the conference proceedings are available in the SMTA Knowledge Base as well as the IEEE Xplore Digital Library. The proceedings can also be purchased in the SMTA Book Store.
About IWLPC
IWLPC brings together the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV and integrated system packaging.
Going into its 16th year, the IWLPC is co-produced by Chip Scale Review, the leading international magazine addressing the semiconductor packaging industry, and SMTA, the distinguished global association representing electronic assembly and manufacturing professionals.
The conference comprises three parallel technical tracks with two full days of presentations on wafer-level packaging, 3D integration, and advanced manufacturing and test. Professional development courses, keynote speakers, and panel discussions are offered by world-class experts and enable attendees to broaden their technical knowledge. The technical program includes a two-day expo where 75 exhibitors showcase their latest technologies and products. The conference provides a collective network of over 800 industry professionals, including vendors from leading semiconductor companies, foundries, and OSATS, as well as key technology, equipment, and materials suppliers in the exhibit area. Attendees will be inspired by the quantity and quality of the featured new developments and emerging technologies. The 16th Annual Conference will be held October 22-24, 2019 in San Jose, California.
Share on:
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/09/2025 | Andy Shaughnessy, Design007 MagazineTrade show season is wrapping up as we head into summer. Where has the time gone? I hope you all get the chance to take a vacation this year, because I know you’ve earned one. Speaking of which, when was my last vacay? If I can’t remember, it’s probably time for one. It’s been a busy week in electronics, with fallout from the back-and-forth on tariffs taking up most of the oxygen in the room. We have quite an assortment of articles and columns for you in this installment of Must-Reads. See you next time.
Kaynes Technology Acquires Canada-Based August Electronics
05/09/2025 | PRNewswireAugust Electronics Inc. is pleased to announce that it has entered into a definitive agreement to be acquired by Kaynes Canada Limited, a wholly owned step-down subsidiary of Kaynes Technology India Limited, a leading Electronics System Design & Manufacturing (ESDM) company. The transaction is expected to close by the end of May 2025, subject to customary regulatory approvals and closing conditions.
Localized Automation Becomes a Tariff Storm Safe Haven, but U.S. Smart Factory Build-Out Costs Far Exceed China’s
05/09/2025 | TrendForceTrendForce’s latest “Human-Machine Technology Report” points out that although the 90-day delay on the U.S. reciprocal tariffs announced by the Trump administration in early April 2025 offers temporary relief, it has already triggered lasting shifts in global manufacturing and supply chain strategies.
Primech AI Plans Production of 300 HYTRON Robots through its China Manufacturing Expansion
05/09/2025 | Globe NewswirePrimech AI Pte. Ltd., a subsidiary of Primech Holdings Limited announced a significant expansion of its manufacturing capabilities through a strategic manufacturing partnership in Guangdong Province, China.
Ultrahuman Expands its American Factory’s Manufacturing Capacity
05/09/2025 | GlobeNewswireUltrahuman, a pioneer in health optimization technology, has announced that it’s ramping up its capacity of the Ring AIR. Ultrahuman’s manufacturing facility (UltraFactory) in partnership with SVtronics, a US-based electronics manufacturing business, has been operational in Plano, Texas, since November 2024.