Flexible Thinking: Integrated Passive Devices—Design Solutions With Many Benefits
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Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBsRTW IPC APEX EXPO 2019: Uyemura Discusses Heavy Gold Deposition
February 13, 2019 | Real Time with...IPCEstimated reading time: Less than a minute
Richard DePoto, business development manager at Uyemura, brings Pete Starkey up to speed on the success of the heavy gold deposition process they discussed last year. Learn how it has been seamlessly integrated into standard ENEPIG lines to give a choice of finishes, and how advances in electroless palladium have enabled the elimination of electroless nickel for high-speed signal integrity.
To watch the interview, click here.
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