Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
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Nolan's Notes: The Next Killer App in Component Manufacturing
RTW IPC APEX EXPO 2019: MacDermid Alpha Highlights Solutions to Combat Voids in Solder
February 20, 2019 | Real Time with...IPCEstimated reading time: Less than a minute
Joe Fjelstad speaks with Paul Salerno, global portfolio manager at MacDermid Alpha Electronics Solutions, about their latest product and process solutions to combat voids in solder including modifications in pastes, preforms, and vacuum assist soldering.
To watch the interview, click here.
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