Flexible Thinking: Designing Flex Circuits for Dynamic Reliability
Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
RTW IPC APEX EXPO 2019: Lenthor Discusses Facility Expansion and New Equipment
February 20, 2019 | Real Time with...IPCEstimated reading time: Less than a minute
Rich Clemente, general manager of Lenthor Engineering, discusses with Dan Feinberg, I-Connect007 Guest Editor, the company’s expansion and new facility and equipment. He also talks about his outlook for the electronics manufacturing industry in North America.
To watch the interview, click here.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Hon Hai, Mitsubishi Electric Exploring Automotive Equipment Business in MOU
04/29/2026 | Hon Hai Precision Industry Co., Ltd.Hon Hai Precision Industry Co. Ltd. (Foxconn) and Mitsubishi Electric Corporation have signed a Memorandum of Understanding to explore a strategic alliance through joint operation of the automotive equipment business.
SEMIEXPO Heartland 2026 Highlights Automotive Electronics and Smart Manufacturing Innovation
04/29/2026 | SEMIThe second edition of SEMIEXPO Heartland opens this week, April 29-30 at the Detroit Marriot at the Renaissance Center in Detroit, Michigan, centered around smart manufacturing, automotive electronics, and workforce development.
AI Reshaping the Memory Market; Effects Spreading Across Industries
04/29/2026 | Dr. Shawn DuBravac, Global Electronics AssociationArtificial Intelligence is often framed as a software story focused on algorithms and models. But beneath that narrative lies a more fundamental shift rooted in hardware. AI is not just changing what technology can do; it’s changing how the physical components behind it are produced, allocated, and priced. One of the clearest examples of this shift is now emerging in the global memory market.
ICTC Adds Parylene Coating Capability with New KR850L System
04/28/2026 | ICTCInterconnect Cable Technologies Corporation (ICTC), a global contract manufacturer, has added in-house parylene coating capability with the installation of a new KR850L system, expanding its value-added services and giving customers a more streamlined path from build to protection.
Call for Abstracts for Third Pan-European Electronics Design Conference
04/27/2026 | Global Electronics AssociationThe German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association are officially opening the Call for Abstracts for the Third Pan-European Electronics Design Conference (PEDC).
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in