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From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
The Automation Advantage
In this issue, we discover how AI, machine learning, and practical factory automation are reshaping PCB fabrication, and where these tools can meaningfully move your business forward.
Thank you, Columnists
This month, we give thanks to our columnists—the brilliant minds who share their expertise, experiences, and passion for the PCB industry. Meet the people behind the pages, learn what drives them, and discover their personal stories.
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RTW IPC APEX EXPO 2019: Super PCB Discusses High-end PCB Procurement Services
February 21, 2019 | Real Time with...IPCEstimated reading time: Less than a minute
Kelly Dack speaks with Jessica Zhang, program manager for Super PCB, who focuses on serving customers with a small-business-type relationship. Based in Plano, Texas, Super PCB matches customer design requirements to a myriad of supplier capabilities through time-saving, direct communication with the supplier and best pricing.
To watch the interview, click here.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Proper Plane Design Techniques
02/12/2026 | I-Connect007 Editorial TeamContinuing our discussion from the November issue of Design007 Magazine on proper plane design, Kris Moyer, an instructor for the Global Electronics Association, shares techniques he teaches his PCB design students to use. When it comes to plane design, there are several challenges with modern high-speed designs. Planes, or more specifically, mirror/return paths, are critical to proper controlled impedance transmission line design. Additionally, to mitigate high-speed switching “noise,” the use of planar capacitance is now necessary and critical.
PCB Design in 2026 and Beyond
02/12/2026 | Filbert Arzola, RaytheonWe asked several experts in PCB design and fabrication about the pressures shaping PCB fabrication today, including speed, density, geopolitics, and relentless technological complexity. The results were valuable insights about where we are, where we’re headed, and importantly, what it will take to get there. Here is Filbert (Fil) Arzola's view of what will be most important and influential for PCB designers going into 2026 and beyond.
EIPC Winter Conference Review: A Focus on Miniaturization
02/12/2026 | Pete Starkey, I-Connect007The theme of the first technical session of EIPC’s Winter Conference in Aix-en-Provence on Feb. 3 was “Miniaturisation and fine-line PCB production: From design to manufacturing.” The session was moderated by EIPC Vice President Thomas Michels, CEO of ILFA in Germany. The theme of the conference is “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The opening presentation came from applications engineering specialist Dr. Roland Steim of Dyconex in Switzerland, who described how the company has addressed the challenges of miniaturisation and fine-line PCB production.
February Issue of Advanced Electronics Packaging Digest Examines the Evolving Role of Packaging
02/11/2026 | I-Connect007 Editorial TeamI-Connect007 is excited to announce that the upcoming issue of Advanced Electronics Packaging Digest (AEPD) will be delivered to subscriber inboxes on Feb. 16, offering in-depth perspectives on the technologies and system-level thinking shaping the future of electronics packaging. As performance demands rise, advanced packaging is increasingly central to integration across the electronics ecosystem. This issue of AEPD examines how packaging decisions increasingly influence design, materials selection, manufacturing strategy, and overall system performance.
EIPC Winter Conference 2026 Review: The Keynote Sessions
02/11/2026 | Pete Starkey, I-Connect007Aix-en-Provence (pronounced “ex-ahn-pro-vonse”), a historic city and commune in the south of France, about 20 miles north of Marseille, was the pleasant venue for EIPC’s Winter Conference in early February. Industry delegates from 11 European countries, as well as from the U.S. and China, gathered at the Renaissance Hotel for a two-day programme, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” An added attraction was a privileged visit to the ITER fusion power project at the Cadarache research and development centre.