Canalys Expects Fewer Than Two Million Foldable Smartphones Will Ship in 2019February 25, 2019 | Canalys
Estimated reading time: 1 minute
Foldable phones have arrived, in the shape of the Samsung Galaxy Fold and Huawei Mate X. More vendors will soon follow with their own takes on foldable displays, but 2019 will not be the year that foldable phones go mainstream. They will remain exclusively ultra-luxury devices, and Canalys expects fewer than 2 million foldable phones will ship worldwide in 2019.
“Foldable phones are now in mass production, and vendors have set realistic expectations for their sales performance,” said Canalys Senior Director Nicole Peng. “Samsung and Huawei will account for the majority of foldable smartphones shipped in 2019. But high shipment numbers are not the priority. The goal is to capture consumer awareness, and each vendor wants to prove it can achieve the greatest technological advances with its new industrial designs.”
“Cost is the key factor that will hinder adoption,” said Canalys Senior Analyst Ben Stanton. “The ‘fold-out’ design (with the screen on the outside, as used on the Mate X) will eventually lend itself to cheaper devices, as manufacturers won’t need to include as many cameras, nor a second ‘outside’ screen (which the Samsung has), and the bend on the flexible screen won’t need to be as tight. But these devices will come too late to affect this year’s shipment numbers significantly. In 2019, vendors offering foldable phones must ensure excellent quality and durability. Any early teething problems or breakages will sour the foldable form-factor before it has had a chance to get going.”
Canalys is an independent analyst company that strives to guide clients on the future of the technology industry and to think beyond the business models of the past. We deliver smart market insights to IT, channel and service provider professionals around the world. We stake our reputation on the quality of our data, our innovative use of technology and our high level of customer service.
Global IT corporation FPT recently signed a Memorandum of Understanding (MoU) with the multinational industrial technology conglomerate Siemens, fostering collaboration and mutually beneficial business opportunities in advancing the manufacturing sector and semiconductor chip production while accelerating digital transformation globally.
Wearable Devices Ltd. , a technology growth company specializing in artificial intelligence (“AI")-powered touchless sensing wearables, today announced a collaboration agreement with Qualcomm Technologies, Inc. This collaboration will help those looking to use Wearable Devices' innovative Mudra technology when developing products using the Qualcomm Snapdragon Spaces™ XR Developer Platform, redefining interaction in augmented reality (“AR”) and virtual reality (“VR”) environments.
Coffee has helped power people for years. Now, coffee and other bio-based resources may help power lithium-ion batteries, thanks to breakthrough technology from X-BATT®.
StenTech® Inc., a leading global company specializing in SMT Printing Solutions, has completed a major technology update to their Photo Stencil Specialized Products Division in Golden, Colorado. The phase-one overhaul included upgrades to key areas, including imaging, chemical plating, and chemical coating, along with refreshed offices and board room.
SMTA will be hosting a new symposium on March 26th in Phoenix focused on Ultra High-Density Interconnect (HDI) technology. As the semiconductor industry charges forward, demanding ever-increasing performance and miniaturization, the SMTA Ultra HDI Symposium sets the stage for industry pioneers, researchers, engineers, designers, and academia to engage in the active sharing of information while addressing the complexities and innovations reshaping the world of Ultra HDI technology.