Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
FCCL Makers Keen to Develop New Material Solutions for 5G
March 8, 2019 | DigitimesEstimated reading time: Less than a minute
Taiwan makers of flexible copper clad laminate (FCCL) and coverlay, materials for flexible PCBs, are gearing up to develop new material solutions and build new production lines to cash in on huge demand for FPCBs for 5G smartphones, according to a Digitimes report.
Among them, Taiflex Scientific has completed preparations for volume production of newly developed heterogeneous modified polyimide (PI) materials, although downstream clients have yet to show clear willingness to incorporate the new materials. Taiflex is building new production lines at its plant in Nantong, China's Jiangsu Province, with construction to be completed in the third quarter of 2019 for trial runs in the fourth quarter. This is expected to enable the company to embrace the first wave of explosive demand for new 5G materials in 2020.
Another major maker, Asia Electronic Materials (AEM) is also constructing a new fab in Dongtai, also in Jiangsu Province, which will accommodate a maximum of 10 production lines. The company is set to start the first-stage trail runs of the new facilities in August 2019.
Share on:
Suggested Items
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
04/15/2025 | Michael Carano -- Column: Trouble in Your TankThere are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.
IDTechEx Highlights Recyclable Materials for PCBs
04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.
Connect the Dots: Stop Killing Your Yield—The Hidden Cost of Design Oversights
04/03/2025 | Matt Stevenson -- Column: Connect the DotsI’ve been in this industry long enough to recognize red flags in PCB designs. When designers send over PCBs that look great on the computer screen but have hidden flaws, it can lead to manufacturing problems. I have seen this happen too often: manufacturing delays, yield losses, and designers asking, “Why didn’t anyone tell me sooner?” Here’s the thing: Minor design improvements can greatly impact manufacturing yield, and design oversights can lead to expensive bottlenecks. Here’s how to find the hidden flaws in a design and avoid disaster.
Real Time with... IPC APEX EXPO 2025: Tariffs and Supply Chains in U.S. Electronics Manufacturing
04/01/2025 | Real Time with...IPC APEX EXPOChris Mitchell, VP of Global Government Relations for IPC, discusses IPC's concerns about tariffs on copper and their impact on U.S. electronics manufacturing. He emphasizes the complexity of supply chains and the need for policymakers to understand their effects.