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Top 10 Most-Read SMT007 Articles for MarchApril 1, 2019 | I-Connect007
Estimated reading time: 2 minutes
Starting today, we will take a look back at the most popular SMT007 news, articles, interviews, and columns. These are the top 10 most-read SMT007 articles for the month of March. Check them out.
Aculon CEO Edward Hughes and Editor Pete Starkey discuss surface modification technologies based on nanochemistry. Of particular interest to electronics technologists are recent developments in waterproofing treatments for assemblies, and how Aculon's strategic partnership with Henkel opens up new opportunities.
The time was right for Tesla to bring new thinking into the concept of electric transportation when the company observed the quantum shift in battery technology from lead-acid to lithium-ion that had been driven by developments in portable consumer electronics.
The characteristics of successful automation application in manufacturing depend on how well business and technical management understand and promote the strategies, tactics, and philosophies used in modern manufacturing. This article briefly outlines the background of computer-integrated manufacturing (CIM) and its evolution to Industry 4.0 and smart factories.
During IPC APEX EXPO, Editor Dan Feinberg spoke with David Bergman, IPC VP of standards and technology, about CFX, IPC’s Connected Factory Exchange software for machine-to-machine communication. With more than companies now supporting CFX, IPC set up two full lines for demonstration at the show.
In an interview with I-Connect007, Digi-Key COO Dave Doherty discusses supply chain disruptions and shortages and shares a number of ways in which Digi-Key is helping to smooth out the delivery of components even with the current turmoil.
David Hillman from Collins Aerospace and IPC's Teresa Rowe speak with Editor Dan Feinberg about how a seemingly simple question resulted in years of committee work to develop the JS-001 standard on the use of conformal coatings and avoiding tin whiskers.
Vexos Senior Vice President for Global Supply Stephanie Martin gives the I-Connect007 editorial team a wide-ranging and insightful overview of the current parts supply situation from the perspective of procurement at a contract manufacturer.
At IPC APEX EXPO 2019, Dr. Jennie S. Hwang, a columnist, author, and all-around an expert in PCB assembly, discusses some of the changes she has seen since joining the industry, and disruptive technologies that technologists we are going to have to face in the near future. Are you ready for the future?
Chris Nash, product manager for PCB assembly solder paste at Indium Corporation, speaks with Kelly Dack and highlights Indium’s take on three important aspects of reliability: thermal, mechanical, and electrical. He talks about challenges of all three aspects, which include solder voiding, and how Indium helps the industry address these issues through its solder paste formulations.
Sharon Starr, IPC's director of market research, provides updates on the EMS and PCB industry outlook, benefits of IPC membership and participation, plans to expand the EMS statistical program, and new studies being published.
Indium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on the application of new soldering thermal interface materials (TIMs) in advanced packaging at SiP China Conference 2023 on December 13 in Shanghai.
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Agility Manufacturing Inc. has finalized the purchase of their second Hentec/RPS Vector 460 selective soldering system.
Indium Corporation is proud to announce the addition of Sales Engineer Meik Fratzel to its European team.
Transition Automation, Inc. recently received a large order for Advanced Holder and Blade Assemblies compatible with DEK printers from Rotec BV in Belgium.
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its new NC259FPA Ultrafine No Clean Solder Paste, which it revealed recently during the Productronica Germany trade show.