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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Microelectronics Network Launches Semiconductor Workforce Advisory Committee

09/15/2026 | SEMI
The National Network for Microelectronics Education (NNME) announced the formation of its inaugural Industry Advisory Committee, bringing together senior leaders from the semiconductor industry, universities, and community colleges to help guide the network's national workforce strategy and strengthen the talent pipeline supporting America's growing microelectronics ecosystem.

Advanced Packaging at the Limits: What’s Ahead in the Next Issue of Advanced Electronics Packaging Digest

09/15/2026 | I-Connect007
The upcoming issue of Advanced Electronics Packaging Digest looks at what happens as advanced packaging pushes further into the limits of scale, power, thermal performance, and manufacturing capability. These features examine the measurement technologies, materials decisions, manufacturing investments, and system-level challenges shaping the next generation of advanced electronics.

Edge4Vets: Changing Lives Through Opportunity

09/15/2026 | Dan Beaulieu
Companies throughout the PCB, EMS, semiconductor, microelectronics, aerospace, defense, and medical electronics sectors need dependable people who can think clearly, learn quickly, solve problems, work safely, and perform as part of a team. Meanwhile, thousands of exceptionally capable military veterans are returning to civilian life with those very qualities. The challenge is bringing these two groups together, and helping each understand the other. That is the mission of Edge4Vets, founded by Tom Murphy, director of the Human Resiliency Institute at Fordham University’s Gabelli School of Business.

Dr. Jennie Hwang to Deliver Two PDCs at SMTA International 2026

09/14/2026 | Dr. Jennie Hwang
Dr. Jennie Hwang to deliver two PDCs on “AI-Powered Manufacturing: From Fundamentals to Factory Impact” (PDC5) and “Mastering Intermetallics for Reliable Electronics” (PDC2) at the 2026 SMTA International Conference.

RapidDirect Launches PCB Division to Integrate PCB and Mechanical Manufacturing

09/11/2026 | Globe Newswire
RapidDirect, a leading global provider of custom on-demand digital manufacturing, announced the official launch of its new Printed Circuit Board (PCB) division.
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