Nolan’s Notes: Is Mexico the Pulse of Electronics in the Americas?
Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Yamaha Unveils Manufacturing Solutions at SMT Connect 2019
May 20, 2019 | Yamaha Motor Europe SMTEstimated reading time: 2 minutes
At SMT Connect 2019 in Nuremberg, Yamaha Motor Europe SMT Section revealed more details of new surface-mount equipment and software tools joining the Yamaha Total Line Solution to boost productivity and quality.
“Europe’s high-tech sector is extremely active right now and we met many visitors engaged in ongoing projects seeking solutions to specific challenges,” said Ichiro Arimoto. “We introduced important innovations throughout our Total Line Solution that are designed to overcome the challenges they are facing.”
Yamaha’s latest equipment line-up now adds the YSP10 screen printer with next-generation automated features. Seen for the first time in Europe at SMT Connect, the YSP10 eliminates human intervention from product changeovers by automatically changing the program, stencil, and support pins and recovering unused solder paste. Yamaha technical specialists showed how this advanced automation cuts changeover time from several minutes to about 70 seconds. 510mm x 510mm maximum board size tackles today’s toughest challenges such as large display-backlight panels and industrial boards.
Alongside the YSP10, Yamaha also showcased the latest in high-speed mounting with the enhanced YSM20R. Introducing 0201-chip component-placement capability, the YSM20R also delivers a 5% speed boost leveraging faster X-Y axis speeds. Further innovations include fully automated feeder and tray exchange that cut downtime during changeovers or replenishment to the bare minimum.
With the latest YSi-SP, dedicated to solder-paste inspection, Yamaha’s proven 3D vision expertise further enhances quality assurance. Advanced features include proprietary high-speed vision algorithms and selective super-high resolution to tackle challenging areas containing small or densely-spaced pads.
In addition, enhancements to the YSi-V post-placement AOI system include a full-HD LCD touch panel with enhanced navigation to maximise the combination of the YSi-V’s12Mpixel camera and exclusive image-capture technology for super-accurate inspection capability.
Visitors also discovered two new features of Yamaha’s Factory Tools 4.0 software suite. The powerful new Dashboard shows current status and historical line data with depth and clarity, while the innovative Image Viewer greatly accelerates visual analysis and troubleshooting. By simply clicking on a Dashboard item, users can call up digital images from any camera onboard the printer, mounters, SPI and AOI in each line.
Completing the enhancements presented at SMT Connect, upgrades to the YST15 intelligent component-storage system enhance job preparation with new automated features that assist program optimisation and reserve needed components in inventory.
About Yamaha SMT Section
Yamaha Surface Mount Technology (SMT) Section is a subdivision of Yamaha Motor Robotics Business Unit in Yamaha Motor Corporation. Yamaha surface mount equipment is highly acclaimed in the market for their “module concept” that enables them to keep pace with the trend toward smaller and more diverse electric/electronic parts being mounted on circuit boards.
Yamaha SMT Section has created a strong business in the surface mount industry that enables design and engineering, manufacture, sales and service to be conducted in one comprehensive system. Furthermore, the Company has used its core technologies in the areas of servo-motor control and image recognition technology for vision (camera) systems to develop solder paste printers, 3D solder paste inspection, 3D PCB inspection machines, flip chip hybrid placers and dispensers. This allows Yamaha SMT Section to offer a full line of machines for electric/electronic parts mounting and propose optimum production-line makeup to answer the diversifying needs of today’s manufacturers.
Yamaha SMT Section has sales and service offices in Japan, China, Southeast Asia, Europe and North America provide a truly global sales and service network that will safeguard best in class on-site sales & service support for clients.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.