-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
The Automation Advantage
In this issue, we discover how AI, machine learning, and practical factory automation are reshaping PCB fabrication, and where these tools can meaningfully move your business forward.
Thank you, Columnists
This month, we give thanks to our columnists—the brilliant minds who share their expertise, experiences, and passion for the PCB industry. Meet the people behind the pages, learn what drives them, and discover their personal stories.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Bernd Flossbach Rejoins Ventec as Technical Sales Rep, Germany
July 15, 2019 | VentecEstimated reading time: 2 minutes
Ventec International Group Co., Ltd., a world leader in the production of polyimide & high reliability epoxy laminates and prepregs and specialist provider of thermal management and IMS solutions, is pleased to announce that Bernd Flossbach has rejoined the company as technical sales representative for Germany. As a key member of the German sales team, Bernd takes on responsibility for selling and supporting all product lines to help the company further develop its presence in the region.
Driven by its strengthening position, particularly in the German automotive & aerospace markets, Ventec is continuing to expand its sales force in the region and adding further technical sales expertise. As from 1st July, Bernd Flossbach resumes his position as technical sales representative as a key member of the German sales team. Having previously held the same position at Ventec for six years, Bernd has spent many years in the industry in technical sales & customer service roles, most recently at Isola. He is highly regarded for his extensive experience, technical knowledge and customer focus.
Bernd said: "The opportunity to come back to Ventec was too attractive for me to refuse. Since leaving in 2018, Ventec has continued to grow and thrive in Germany and internationally, and I am very impressed with everything that is going on. We have great solutions that deliver according to the demands of our customers’ needs today and in the future. With a solid product development roadmap and a real focus on excellent customer support, my decision to rejoin was very easy for me."
Jürgen Knörchen, director of sales DACH, added: "We are delighted to have Bernd back. His extensive experience in the industry and his knowledge of our solutions are invaluable as he plays a crucial part in working with, and supporting, our German customers. Ventec prides itself on the strength of its people and I am pleased to welcome Bernd back to the team."
About Ventec International Group
Ventec International is a premier supplier to the Global PCB industry. With volume manufacturing facilities in Taiwan and China and distribution locations and manufacturing sites in both the US and Europe, Ventec specializes in advanced copper clad glass reinforced and metal backed substrates. Ventec materials, which include high-quality enhanced FR4, high-speed/low-loss- & high-performance IMS material technology and an advanced range of thermal management solutions, are manufactured by Ventec using strict quality-controlled processes that are certified to AS9100 Revision D, IATF 16949:2016 and ISO 9001:2015, and are backed by a fully controlled and managed global supply chain, sales- and technical support-network. For more information, visit www.venteclaminates.com.
Visit I-007eBooks to download your copy of Ventec micro eBook today:
The Printed Circuit Designer's Guide to...Thermal Management with Insulated Metal Substrates
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Powering the Future: From Thick-Film to DBC—Understanding the Evolution of Ceramic Packaging
02/11/2026 | Brian Buyea -- Column: Powering the FutureCeramic packaging has quietly powered the electronics revolution for more than half a century. From the earliest thick-film hybrids to today’s direct bond copper (DBC) substrates and metallized aluminum nitride, every step forward in ceramic technology has pushed the limits of reliability, power density, and performance. It’s essential for every design engineer building the next generation of electronic systems to understand this evolution.
Fresh PCB Concepts: Cost Stability in a Period of Copper and Gold Volatility
02/12/2026 | Team NCAB -- Column: Fresh PCB ConceptsAnyone who works with PCBs in any capacity right now can feel that copper and laminate prices are not stagnant, gold price is increasing even faster, and the impact shows up quickly on PCB quotations. For many design teams, this feels like a force outside their control. Raw materials go up, and the board cost goes with it. I want to highlight that many of these swings are manageable.
Connect the Dots: The Future of Designing for Reality—Pattern Plating
02/05/2026 | Matt Stevenson -- Column: Connect the DotsLast month, I discussed the outer-layer imaging process and offered tips for designers to help ensure smooth manufacturing and high-quality output. The next step in the manufacturing process is copper pattern plating, where fabrication can be tricky, and design precision is even more important. The board is now ready to have the copper traces, through-holes, vias, pads, and other elements specified in the original CAD design plated to copper thickness requirements. I will identify some key design considerations for pattern plating, break down the process, and offer design tips for a successful outcome.
PCBAIR Upgrades Heavy-Copper PCBs to Solve AI Thermal Bottlenecks
01/20/2026 | PRNewswireAs computational demands for AI models surge, the hardware powering them faces a critical physical limitation: thermal management.
TÜV Rheinland Advances Electronics Supply Chain Traceability
01/13/2026 | BUSINESS WIREWith electronic devices being replaced at an ever-faster pace, global volumes of consumer e-waste continue to climb.