IPC E-Textiles 2019 to Address Real World of Applications for Multiple Markets
August 5, 2019 | IPCEstimated reading time: 2 minutes
IPC E-Textiles 2019, a two-day technical education workshop for innovators, technologists and OEMs/brands to learn about the latest developments, designs and manufacturing concepts in the converging industries of textiles and electronics, will feature 14 technical presentations, tours of the Drexel Center for functional fabrics, a special interactive session and an IPC D-70 E-Textiles Committee Standards meeting. IPC E-Textiles will take place at the Drexel University Center for Functional Fabrics in Philadelphia, Pa., September 10-11.
Highlights of the agenda include:
- Advanced inkjet printed e-textiles for health monitoring in military applications
- E-textiles systems for military personal area networks
- Addressing challenges for e-textiles in automotive conditions
- Wearable e-textiles for telemedicine and energy storage
- Smart garment production
- Latest advancements in e-textile fabrics, fibers, yarns and printed materials, and much more
IPC E-Textiles 2019 will provide a platform for education and collaboration among a diverse group of professionals interested in producing e-textiles as well as to attract a myriad market segments, including fashion design, health monitoring, medical, automotive and military/aerospace. Unique to any other e-textiles conference you will attend in the US this year, this event will also kick off with an IPC D-70 E-Textiles Committee meeting, where industry can collaborate on and influence e-textiles standards being developed by the committee.
“Interdisciplinary collaborations are necessary to launch e-textile products,” said Stephanie Rodgers, Apex Mills and IPC E-Textiles 2019 program committee chair. “I’m looking forward to seeing the innovators, designers, material suppliers, integrators, electrical, mechanical and textile engineers along with members of academia in the same room, working together to discuss solutions to the issues we face in this industry. All disciplines will be engaged in the development and testing of electronic integrated textiles. Additionally, the tour of the Pennsylvania Fabric Discovery Center will tempt the maker in all of us.”
Of particular interest to attendees will be the tours of the Drexel University Center for Functional Fabrics (CFF), which gained national and international recognition for its groundbreaking functional fabrics research. Its methodology is defined by an integrated “design thinking and doing” approach that combines human-centered design with fabrication, from prototyping and making of a product to full system integration.
The CFF houses the Pennsylvania Fabric Discovery Center (PA FDC), which serves as a regional hub that facilitates advanced textile manufacturing in Pennsylvania and the Mid-Atlantic Region (New York, New Jersey, Pennsylvania, Delaware, and Maryland).
For more information on or to register for IPC E-Textiles 2019, visit www.ipc.org/E-Textiles-2019. For more information on the D-70 E-Textiles Committee, contact Chris Jorgensen, IPC director of technology transfer, at ChrisJorgensen@ipc.org.
About IPC
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 5,400 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
Suggested Items
Canadian Circuits Inc. Unveils Rapid Prototype PCB Assembly Service to Accelerate Innovation
05/14/2025 | Canadian Circuits, Inc.Canadian Circuits Inc. (CCI), a leading provider of high-quality, made-in-Canada, Printed Circuit Board (PCB) solutions, is proud to announce the launch of its Prototype PCB Assembly (PCBA) service. This new offering enhances CCI’s commitment to empowering engineers and OEMs by accelerating the journey from concept to product launch with precision and efficiency in electronics manufacturing.
From DuPont to Qnity: A Bold Move in Electronics Materials
05/14/2025 | Marcy LaRont, I-Connect007DuPont has announced the intended spinoff of a public independent electronics company, Qnity, which will serve as a solutions provider to the semiconductor and electronics industries to enhance competitiveness and innovation in advanced computing, smart technologies, and connectivity. In this interview, Jon Kemp, Qnity CEO-elect and current president of DuPont’s Electronics business, shares his insights on the strategic separation from DuPont.
Legislative Update: Is the SEMI Investment Act Inclusive of PCB and Substrates?
05/13/2025 | I-Connect007 Editorial TeamIn response to this week's news about new U.S. legislation being put forth by SEMI to support our domestic electronics supply chain—the Strengthening Essential Manufacturing and Industrial (SEMI) Investment Act—IPC’s Richard Capetto, senior director of North American Government Relations, made the following statement.
The Test Connection Inc. Appoints USM Reps as Exclusive Sales Representative in Mexico
05/13/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is pleased to announce the appointment of USM Reps as its exclusive sales representative in Mexico.
Top 10 OSAT Companies of 2024 Revealed—China Players See Double-Digit Growth, Reshaping the Global Market Landscape
05/13/2025 | TrendForceTrendForce’s latest report on the semiconductor packaging and testing (OSAT) sector reveals that the global OSAT industry in 2024 faced dual challenges from accelerating technological advancements and ongoing industry consolidation.