Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Nolan’s Notes: Everyone Has Their Eye on India
Emerging Technologies Take Center Stage at IPC Electronics Materials Forum
September 11, 2019 | IPCEstimated reading time: 2 minutes
The IPC Electronics Materials Forum is a new technical conference focused on developments in materials and processes associated with advanced electronics assembly and manufacturing for board fabrication, assembly and post-assembly protection. The three-day forum, to be held November 5-7 in Bloomington, Minn. will be co-located with a Pb-free Electronics Risk Management (PERM) Council meeting.
Geared toward engineers and managers that procure materials or seek an understanding of advancements in materials for the board, assembly, components and protective layers, the IPC Electronics Materials Forum will emphasize the emerging technologies that challenge the existing materials set. Interactive panels and networking opportunities will provide attendees an open forum to discuss solutions to challenges.
The Forum will feature a keynote by Lenora Clark, director, autonomous driving and safety technology for MacDermid Alpha Automotive, who will present insights into all aspects of electronics, uniting circuitry, semiconductor and assembly solutions to support future automotive market needs.
“You can envision many future technologies, but you cannot create them without materials and processes to manufacture them,” said Brook Sandy-Smith, technical conference program manager. “Emerging technologies that challenge our existing materials set will inform the developments needed for the future, and we have an impressive lineup of speakers, including Lenora Clark as our keynote, at IPC Electronics Materials Forum to lead the way.”
More than 20 companies will be represented at the Forum, including Continental Automotive Systems, Averatak, Calumet Electronics, Indium, Lockheed Martin and Raytheon, among others.
Topics to be presented include:
- Semi-additive processes for high density interconnect
- Additive textile manufacturing for electrical connections
- SIR test method for underfill reliability in automotive electronics
- Digitization of organic electronics information: Materials, manufacturing and devices
- Reliable and cost-effective nickel-free solutions for high-frequency/high-density applications
- Evaluation of PCB through hole plating, drill, and desmear quality for new laminate materials
- Trends and developments in electronic protection materials
For more information about the IPC Electronics Materials Forum or to register, click here.
About IPC
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 5,500 member-company sites which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Smartphone Production Rises 4% QoQ in 2Q25 as Inventory Adjustment Ends
09/12/2025 | TrendForceTrendForce’s latest investigations reveal that global smartphone production reached 300 million units in 2Q25, up 4% QoQ and 4.8% YoY, driven by seasonal demand and the recovery of brands such as Oppo and Transsion following inventory adjustments.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/12/2025 | Marcy LaRont, I-Connect007We may be post-Labor Day, but it is still hot-hot-hot here in the great state of Arizona—much like our news cycles, which have continued to snap, crackle, and pop with eye-raising headlines over this past week. In broader global tech news this week, AI and tariff-type restrictions continues to dominate with NVIDIA raising its voice against U.S. lawmakers pushing chip restrictions, ASML investing in a Dutch AI start-up company to the tune of $1.5 billion, and the UAE joining the ranks of the U.S. and China in embracing “open source” with their technology in hopes of accelerating their AI position.
Delta Electronics Posts 26.7% Growth in Sales Revenues for August
09/12/2025 | Delta ElectronicsDelta Electronics, Inc. announced its consolidated sales revenues for August 2025 totaled NT$47,860 million, a 26.7 percent increase as compared to NT$37,770 million for August 2024 and a 5.4 percent increase as compared to NT$45,397 million for July 2025.
Flex Named to TIME's World's Best Companies List for Third Consecutive Year
09/12/2025 | FlexFlex announced its inclusion on the TIME World's Best Companies 2025 list. This marks the third consecutive year the company was included in this prestigious ranking, which recognizes top-performing companies across the globe.
Direct Imaging System Market Size to Hit $4.30B by 2032, Driven by Increasing Demand for High-Precision PCB Manufacturing
09/11/2025 | Globe NewswireAccording to the SNS Insider, “The Direct Imaging System Market size was valued at $2.21 Billion in 2024 and is projected to reach $4.30 Billion by 2032, growing at a CAGR of 8.68% during 2025-2032.”