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SMTA 2019 International Awards
September 30, 2019 | Nolan Johnson, I-Connect007Estimated reading time: 1 minute
The SMTA International conference—held September 22–29, 2019, at the Stephens Convention Center in Rosemont, Illinois—honored industry members with awards for their contributions to the industry. I-Connect007 has compiled an unofficial list of award recipients. The official list from SMTA will be released shortly, and I-Connect007 will publish it as soon as it is available.
Members of Distinction Award Winners for 2019
Founders Award: Charles E. Bauer, Ph.D., TechLead Corporation
Member of Technical Distinction Award: Dudi Amir, Intel Corporation
Excellence in International Leadership Award: Ivan Romo, SMarTsol Technologies
Excellence in Leadership Award: Greg Kloiber, Ducommun
SMTA+ Corporate Award: Intel Corporation
Grant/Scholarship Winners for 2019
Hutchins Grant: Benjamin Stewart, Georgia Institute of Technology
Stromberg Scholarship: Kim Porter, Lorain County Community College
2018 SMTA International Conference Award Winners: Rich Freiberger, Best of Conference Presentation
"The Role of Nickel in Solder Alloys, Part 2: The Effect of Ni on The Integrity of The Interfacial Intermetallic in Sn-Based Solder Joints to Copper Substrates," Kazuhiro Nogita, The University of Queensland
Best of Proceedings Paper
First Place: "Alloy Composition and Thermal Fatigue of High-Reliability Pb-Free Solder Alloys," Richard Coyle, Ph. D., Nokia Bell Labs
Second Place: "Dissolution Rate of Specific Elements in SAC305 Solder," David Hillman, Collins Aerospace
Third Place: "The Influence of Printed Circuit Board Thickness on the Thermal Fatigue of Quad Flat No-Lead Packages," Richard Coyle, Ph.D., Nokia Bell Labs
Best Student Paper
"Assessment of Second-Level Interconnect Quality in Flip Chip Ball Grid Array (FCBGA) Package Using Laser Ultrasonic Inspection Technique," Vishnu Reddy, Georgia Institute of Technology
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