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Conductor Analysis Technologies Ships Second Generation OM Thermal Stress System
October 3, 2019 | Conductor Analysis TechnologiesEstimated reading time: Less than a minute
Conductor Analysis Technologies announces the shipment of a second generation OM Thermal Stress System to Robisan Laboratory located in Indianapolis, Indiana. This system builds on the earlier version developed more than 8 years ago with updated technology which performs reflow simulation fully compliant with IPC TM-650 Method 2.6.27.
According to Lance Auer, Engineering Fellow at CAT, the system will be widely available to the printed circuit industry since there is no large price tag associated with its acquisition. It is available on a lease/cost-per-cycle basis to circuit board manufacturers and for sale to qualified OEMs.
About Conductor Analysis Technologies, Inc.
Conductor Analysis Technologies, Inc. is a provider of market-critical data utilized by designers, manufacturers, and users of printed circuit boards. Founded in 1994 our products and services provide a standardized, independent, and documented evaluation of printed circuit manufacturing capability, quality, and reliability.
About Robisan Laboratory, Inc.
Robisan Laboratory, Inc. is a fully accredited independent test and measurement laboratory serving the electronics industry. Our scope is focused on offering mechanical, electrical, and environmental testing, along with failure analysis.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
08/29/2025 | Nolan Johnson, I-Connect007This week, we bring you Global Electronics Association’s Chris Mitchell’s government relations column on—you guessed it—trade deals. TTM is balancing its facilities between East and West. The Global Electronics Association released July numbers for North American PCB shipments, and the news is good. Meanwhile, the corresponding report for EMS might seem like bad news, but that’s misleading. Be sure to look deeper for the rest of the story. Finally, for a bit space-science palate cleansing, I’m sharing news of the latest launch of NASA’s X-37B.
Summit Interconnect Names Milan Shah as Vice Chairman of the Board
08/26/2025 | Summit Interconnect, Inc.Summit Interconnect, a leading provider of advanced PCB manufacturing, today announced that Milan Shah has been named Vice Chairman of the Board.
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
08/25/2025 | Chris Mitchell -- Column: The Government CircuitAs global trade winds continue to howl, the electronics manufacturing industry finds itself at a critical juncture. After months of warnings, the U.S. Government has implemented a broad array of tariff increases, with fresh duties hitting copper-based products, semiconductors, and imports from many nations. On the positive side, tentative trade agreements with Europe, China, Japan, and other nations are providing at least some clarity and counterbalance.
Lessons From a Thousand Columns: Dan Beaulieu on Writing, Selling, and Staying the Course
08/21/2025 | Michelle Te, I-Connect007For 20 years, Dan Beaulieu has been a steady voice in sales and marketing, offering weekly columns that challenge, inspire, and guide professionals in the electronics industry and beyond. Soon, he will reach a remarkable milestone—his 1,000th It’s Only Common Sense weekly column. In this Q&A, we look behind the scenes of Dan’s writing journey, exploring what has kept him motivated, the lessons he’s learned along the way, and how two decades of weekly columns have shaped his career and the industry conversation.
University Of Minnesota Team Claims Victory In Bright Manufacturing Challenge 2025 Round 1
08/19/2025 | EMACThe Electronics Manufacturing & Assembly Collaborative (EMAC) recently announced that Team "Rise and Grind Crew" from the University of Minnesota has emerged victorious in Round 1 of the Bright Manufacturing Challenge 2025.