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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Arlon EMD and US Air Force Academy Establish CRADA
October 4, 2019 | Arlon EMDEstimated reading time: 2 minutes
Arlon EMD, a privately held, veteran owned, specialty laminate manufacturer has entered into an agreement with the United States Air Force Academy to collaborate efforts in researching and developing technology platforms for electronic materials, resin systems and copper-clad laminate products.
The Cooperative Research and Development Agreement (CRADA) between Arlon and the USAFA is a five-year program designed to offer cadets research opportunities in electronic materials science for practical applications in the electronics industry. Under this agreement the USAFA will provide Arlon additional resources for research in material science and resin technologies.
“We are excited to enter into this new relationship with the USAFA. As the only veteran owned, military and aerospace supplier of specialty copper clad laminates in N. America, working with our US Air Force Academy is a good fit. It is an honor to interact with such talented, academically-driven and skilled men and women of our United States Air Force,” stated Brad Foster, President of Arlon.
In this agreement, USAFA cadets will have academic opportunities to conduct research on various resin technologies under the direction of internationally recognized polymer expert Dr. Scott Iacono, Director of the Chemistry Research Center for the USAFA, Colorado Springs, Colorado. “Collaborating with an industrial partner such as Arlon to develop materials will give our cadets exposure to industrial applications of technologies through their independent study courses. We will research resin chemistries and technologies at our USAFA campus and then assist in developing these with Arlon,” commented Dr. Iacono.
About Arlon
Arlon EMD is veteran owned and privately held by CriticalPoint Capital (info@criticalpointcapital.com). Arlon EMD is a US manufacturer and distributor of specialty materials and has supplied specialty materials into the military, avionic, space, semiconductor and petroleum exploration markets for more than 25 years from their manufacturing location in Rancho Cucamonga, California.
For additional information, please visit our website at www.arlonemd.com or contact Deanna Bustamante, Marketing Manager, Deanna.Bustamante@ArlonEMD.com.
About USAFA
With a history of excellence and a focus on the future, the United States Air Force Academy instills cadets with pride and integrity while preparing them to serve their country and succeed in 21st-century careers. As a public university and a military service academy, the USAFA is leading the way into an increasingly complex future, driving advancement and innovation in air, space and cyberspace, among countless other fields. The USAFA has 24 research centers and institutes with emphasis in areas from warfighter effectiveness to high-performance computing. Research at the USAFA reflects the evolving needs of the Air Force in a technology-driven world. Specifically, the Chemistry Research Center (CRC) within the Department of Chemistry at the USAFA focuses on new chemical discoveries to meet operational AF and Department of Defense mission partner needs as well as private partnerships with academia and industry in order to leverage an expanding technology base.
For additional information, please visit our website at www.usafa.edu/research/research-centers/chemistry-research-center
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Brent Fischthal - Koh YoungSuggested Items
Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction
04/20/2026 | Kuldip Johal, MKS' AtotechThe rapid growth of AI computing, from training clusters to inference at scale, is reshaping demand across the entire electronics supply chain. Advances in technology requirements, such as higher bandwidth, lower latency, and greater compute density, are driving the development of advanced packaging technologies and transforming the PCB industry across design, manufacturing, testing, and even architecture.