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Amphenol Printed Circuits Recognizes Panasonic as a Qualified Vendor for Flexible LaminatesOctober 9, 2019 | Amphenol Printed Circuits
Estimated reading time: 1 minute
Amphenol Printed Circuits has qualified Panasonic’s Felios Flexible Laminates and will now increase usage on new part-numbers. Both Amphenol and Matrix have worked diligently to achieve this qualification milestone over the course of 2019.
Panasonic’s Felios is an advanced adhesive-less copper-clad flex circuit material, designed to meet the demanding high performance and reliability requirements of the Aerospace and Commercial Avionics market segments. Panasonic offers the largest selection of both thin and thick copper foil and polyimide film constructions in the industry.
“Panasonic and Matrix are an integral part of our planned growth in the Flexible Circuits business”, stated Christine Harrington, Managing Director, PCB Operations at Amphenol Printed Circuits. “Matrix is providing the best-in-class flexible materials. I would like to thank Matrix and Panasonic for their efforts to qualify and support Amphenol Printed Circuits”.
“Matrix is delighted to be one of Amphenol’s strategic partners, and our Team is committed to servicing the North American PCB marketplace with Felios, the most reliable and most dimensionally stable flexible circuit materials available”, says Jeff Cassell, vice president of Sales at Matrix.
About Matrix USA Inc.
Committed to the motto: “Quality Products, Dependable People”, Matrix was established in 1977 with the objective of providing quality raw material to the North American Printed Circuit Board Industry. Matrix has five Rapid Response warehouses located throughout the US and Canada that fulfill high quality, fast delivery, and custom orders daily. For further information visit: www.matrixusa.us.
About Amphenol Printed Circuits
Amphenol Printed Circuit (APC) is a world leader in the printed circuit industry for Military and Commercial markets, building PCBs, backplanes, flex and rigid-flex products to meet their customers’ demanding needs. APC’s capabilities are among the world’s broadest and most advanced, delivering consistent quality and reliability for demanding high-bandwidth systems and mission-critical applications for more than 30 years. For more information, visit www.amphenol-apc.com.
The "Global Copper Clad Laminates Market (by Type, Application, Reinforcement Material, & Region): Insights and Forecast with Potential Impact of COVID-19 (2023-2028)" report has been added to ResearchAndMarkets.com's offering.
The SCHMID Group, a global solution provider for the high-tech electronics, photovoltaics, glass and energy systems industries, will be exhibiting at productronica in Munich from November 14 – 17, 2023.
The topic of intrinsic copper structure has been largely neglected in discussions regarding the PCB fabrication quality control process. At face value, this seems especially strange considering that copper has been the primary conductor in all wiring boards and substrates since they were first invented. IPC and other standards almost exclusively address copper thickness with some mild attention being paid to surface structure for signal loss-mitigation/coarse properties.
At PCB West, I sat down for an interview with John Andresakis, the director of business development for Quantic Ohmega. I asked John to update us on the company’s newest materials, trends in advanced materials, and the integration of Ticer Technologies, which Quantic acquired in 2021. As John explains, much of the excitement in materials focuses on laminates with lower and lower dielectric constants.
Printed circuit board (PCB) reliability testing is generally performed by exposing the board to various mechanical, electrical, and/or thermal stimuli delineated by IPC standards, and then evaluating any resulting failure modes. Thermal shock testing is one type of reliability test that involves repeatedly exposing the PCB test board to a 288°C pot of molten solder for a specific time (typically 10 seconds) and measuring the number of cycles it takes for a board’s copper layer to separate from the organic dielectric layer. If there is no delamination, fabricators can rest assured that the board will perform within expected temperature tolerances in the real world.