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Real Time with... SMTAI 2019 Video Interviews
October 9, 2019 | Real Time with...SMTAIEstimated reading time: 1 minute
The SMTA International Conference and Exhibition 2019, which took place September 22–26, 2019, at the Donald E. Stephens Convention Center in Rosemont, Illinois, concluded successfully. For those of you who were not able to make it to the show, catch our video interviews with the movers and shakers of the electronics industry. We've updated our video presentation for a better experience for our users, so check it out!
Below is the list of Real Time with… SMTAI 2019 video interviews at the show. Also, visit Real Time with... SMTAI 2019 to view our expansive photo gallery of images captured throughout the exhibition floor.
- EPTAC Continues Its Expansion
- Gary Tanel Provides an SMTA Update
- Michael Ford on IPC-CFX and the Effects of Industry 4.0
- SMTAI 2019 Technical Sessions Overview and 2020 Preview
- Lenora Clark Discusses Company Changes and Her New Role
- Juan Arango Discusses Koh Young America's New Headquarters
- SMTAI 2019: Nir Benson Discusses Mentor's Challenges and Solutions
- Company Updates and Future J-STD-001 Changes
- Creative Electron's Mobile X-ray Van and LED-specialized Equipment
- Chris Bastecki on Low-temperature Solder Challenges and Products
- KIC's New, Smart Factory Products
- Tom Forsythe on Cleaning Challenges and Solutions
- MIRTEC's Newest Product Introduced at SMTAI
- Kristen Mattson on the SMTAI Vacuum Reflow Systems Demo
- Carmichael Gugliotti Discusses His First SMTAI Paper
- SAFI-Tech's No-heat SAC305: A Possible Gamechanger
- George Milad's SMTAI Paper and the IPC ENIG Specification Revision
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Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
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