-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueCounterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
A Culture of Thriving
One cannot simply command thriving; it must be nurtured, developed, and encouraged. In this issue, we explore strategies to improve your working relationship model—both internally and externally. In this culture of thriving, your business will grow in the process.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Mycronic Demonstrates Expanded Portfolio of Products at productronica 2019
October 27, 2019 | PR NewswireEstimated reading time: 3 minutes
For the first time since multiple acquisitions in recent years, Mycronic AB will demonstrate its full portfolio of electronics assembly solutions at productronica in Munich, November 12-15, 2019. In addition to the latest integrated SMT line, jet printing, dispensing, 3D inspection and material handling solutions, the company will highlight its industry-leading automotive camera module assembly and high-precision die bonding solutions.
Enhancing quality, flexibility and productivity
As electronics assembly continues to grow more complex, Mycronic will be showcasing more ways than ever before to improve quality, flexibility and productivity in a range of electronics manufacturing applications. PCB manufacturers will experience new advances in machine-to-machine communication, full SMT line capabilities and automated material handling systems. Automotive electronics manufacturers will gain expertise in the industry-leading Camera Module Assembly and Test (CMAT) system. And manufacturers of advanced photonic and radio-frequency devices will learn more about the industry's first 1.5 micron die bonder for high-precision, high-volume manufacturing.
"All of these state-of-the-art solutions are part of our vision to enable zero-defect assembly with the highest utilization for any product mix," says Thomas Stetter, Sr. VP, Assembly Solutions. "From integrated SMT production lines to advanced packaging and automotive sensors, our aim is to enhance our customers' control over the data, processes and material flows that matter most to their success."
New production insights with enhanced M2M communication
As an active member of the Hermes Standard Initiative, the majority of Mycronic's machine models will now be Hermes compliant. This standardized machine-to-machine communication protocol represents an important step in enabling customers to look beyond discrete manufacturing process steps and gain holistic insights into factory-wide productivity. It will also allow greater vendor-independent capabilities, enabling customer processes and programming to become increasingly driven by board requirements.
Full SMT line solution with expanded capabilities
The recently launched MYPro Line, the company's latest full SMT line solution, will demonstrate a number of new software and automation capabilities at productronica. The SIGMA Link software, which correlates data between solder paste inspection and automated optical inspection, now features more intuitive process controls to further improve inspection efficiency and first pass yield. A new AOI platform with 2x faster programming. A new solder paste inspection and jet printing repair system closes several data feedback loops to automatically increase yield and product quality over time. And a new dashboard and analysis software will demonstrate new ways to simplify production scheduling and enhance overall equipment effectiveness.
New advances in conformal coating and plasma treatment
As part of Mycronic's rapidly evolving MYSmart series of dispensing and conformal coating robots, a number of new hardware and software innovations will be on display at productronica 2019. The industry-leading MYC50 conformal coating system, with its new intuitive user interface, precision spray valve and flow monitoring system, promises to deliver even higher levels of precision, repeatability and yield. In addition, a new series of MYS plasma systems will be launched. The MYS systems offer all the benefits of traditional vacuum plasma systems at atmospheric pressure, with safer, cleaner operations and up to 50 times faster cleaning speeds.
Collaborative robotics for autonomous material handling
In a significant step towards improving labor utilization, Mycronic will also demonstrate a next-generation collaborative robotics system. The solution, developed in collaboration with industry-leading partners, will show the potential for entirely operator-independent retrieval, kitting and distribution of component reels.
High-performance automotive camera module assembly
In addition to these new SMT capabilities, Mycronic will also present the manufacturing solutions and experts behind the industry-leading CMAT system. The millions of sensor modules assembled every year by manufacturers using this system are enabling enhanced automotive safety and, ultimately, autonomous driving. Mycronic's process experts will answer questions regarding design for manufacturing, rapid prototyping, application enhancement and full-scale manufacturing optimization.
Advanced die bonding systems
Finally, visitors to productronica will have the opportunity to learn about the industry's leading high-precision die bonding systems for flexible high-speed assembly of optoelectronics and microelectronics. Mycronic's die bonding experts will be on hand to discuss their complete, cost-effective assembly solutions for all levels of advanced packaging.
To experience live demos and to learn more about Mycronic's MYPro Line, CMAT, die bonding and other assembly solutions, visit Booth A3 341 at productronica in Munich, November 12-15, 2019.
Contact at Mycronic: mycronic.com.
Suggested Items
All Flex Solutions Invests in Assembly Inspection Automation
10/17/2024 | All Flex SolutionsAll Flex has acquired an Omron VP9000 3D Solder Paste Inspection System and an Omron VT-S1080 3D Automatic Optical Inspection System for their flexible circuit assembly facility in Bloomington, Minnesota. These acquisitions are one part of All Flex Solutions’ four-year SMT Roadmap to expand the scale and capability of their assembly operations.
TopLine to Exhibit 'Drop-in Replacement' for BGA at Electronica
10/16/2024 | TopLineTopLine Corporation will exhibit its latest technology solutions at Electronica in Munich, Germany, November 12 – 15, 2024, in stand B4.428.
Indium Experts to Present at International Electronics Manufacturing Technology Conference
10/15/2024 | Indium CorporationIndium Corporation is proud to announce its participation in the upcoming International Electronics Manufacturing Technology Conference (IEMT), taking place October 16-18 in Penang, Malaysia.
Bransys Acquires Two REHM VisionXP+ Nitro 3850 Reflow Ovens
10/14/2024 | BransysBransys Group, a leading provider of comprehensive PCB design and assembly services, is pleased to announce the addition of two REHM VisionXP+ Nitro 3850 Type 834 reflow ovens to its state-of-the-art manufacturing facility.
The SD11 Inkjet Printer and Ventec Giga Solutions
10/10/2024 | Marcy LaRont, PCB007 MagazineVentec expanded last year to provide greater portfolio solutions to its customers, all of which are aligned with Ventec’s core business in laminates and distribution products. I sat down with Ventec Giga Solutions’ Commercial Director Leigh Allinson, who is deeply rooted in both the PCB and supply chain sectors. He explores the innovative realms of the company and its cutting-edge SD11 inkjet printer. Leigh brings insight into the fabric of the electronics manufacturing industry through the lens of pushing technology limits and delving into the strategic expansions of Ventec Giga Solutions.