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UHDI Fundamentals: An Overview of UHDI Layer Types

01/02/2026 | Anaya Vardya, American Standard Circuits
UHDI layer types include core, sequential lamination build-up; microvia; embedded and passive antennas and inductors; and embedded functional, protective, and hybrid rigid-flex layers. Together, they enable ultra-fine features, dense interconnects, high-frequency performance, and miniaturized system designs. UHDI typically requires multiple SBU cycles, where thin dielectric and copper layers are drilled for microvias, plated, imaged, and laminated sequentially to build up to the final design from the inside out.

Global Electronics Association Releases Q4 Standards and Revisions Update

12/24/2025 | Global Electronics Association
Each quarter, the Global Electronics Association releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit electronics.org/ipc-standards. These are the latest releases for Q4 2025.

Advances in Conformal Coating Materials and Methods

11/19/2025 | Saskia Hogan, MacDermid Alpha Electronics Solutions
High-performance electronics must endure everything from rain, dust, and oil to extreme temperatures, shock, and vibration. These reliability demands now share the stage with other priorities such as size reduction, lightweighting, and environmental sustainability. Combined with constant pressure to cut costs, accelerate production, and boost manufacturing efficiency, material suppliers are racing to develop advanced conformal coatings that deliver it all: compatibility with finer-pitch circuitry, durability, eco-friendliness, and manufacturing efficiency.

Voices of the Industry Features Elephantech’s Satoshi Konagai on the Future of Sustainable PCB Manufacturing

11/19/2025 | I-Connect007
I-Connect007 is pleased to announce the release of the latest episode in its acclaimed podcast series, Voices of the Industry. In this episode, host Marcy LaRont speaks with Satoshi Konagai, Executive Officer and Head of Marketing of Elephantech, about the company’s groundbreaking additive manufacturing technology that’s reshaping the printed circuit board (PCB) industry.

Beyond the Board: Why More Defense Primes Are Moving Toward Rigid-flex for Lighter, More Reliable Systems

11/18/2025 | Jesse Vaughan -- Column: Beyond the Board
Over the past decade, the conversation around PCB innovation in aerospace and defense has often centered on high-density interconnects, advanced materials, and tighter design-to-fabrication collaboration. But the move toward rigid-flex is a quieter shift that has been gaining momentum, and it’s changing how primes and system integrators approach the physical architecture of mission-critical electronics.
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