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Yamaha Revealed Smart Solutions to Raise Surface-Mount Productivity at productronica 2019
November 25, 2019 | Yamaha Motor Europe SMTEstimated reading time: 1 minute
Yamaha Motor Europe SMT Section has presented advanced solutions for extending surface-mount assembly capabilities and maximising productivity at productronica 2019, November 12-15 in Munich.
This year’s booth focused visitors’ attention on new software tools for data analysis, automated component handling, innovative pick-and-place, and robotic automation, alongside the YSP printers, YSM mounters, and YSi inspection systems of the Yamaha Total Line Solution.
Yamaha’s Total Line Solution tightly integrates printing, solder-paste inspection, component mounting, and AOI, enhancing data-driven process optimisation. The YSP10 screen printer, which has innovations that reduce waste cleaning paper by up to 80%, received the 2019 Global Technology Award for Printing Equipment.
Three booth displays dedicated to software revealed new features of Yamaha’s Factory Tools 4.0 suite that simplify equipment programming, setup, real-time control, and data analysis. The new Dashboard lets users easily visualise performance and identify historical trends while another new utility, Image Viewer, helps store and quickly retrieve images for any inspection site on any board to support troubleshooting or traceability. Ichiro Arimoto, General Manager, explained, “This state-of-the-art software turns the data from our machines into actionable insights, empowering our customers to achieve the improvements they are seeking.”
Yamaha also showed how the latest YST15 intelligent component storage tower connects with autonomous guided vehicles (AGVs) that deliver required components, pre-loaded on the feeder cart, to the right placement machine, at the right time, anywhere in the factory. Together, the YST15 and AGVs ensure components reach the point of use exactly when needed and let factory staff focus on high-value tasks.
A special display presented advanced Yamaha robots for automated assembly, showing how the latest double-carriage N15D and high-thrust F14H transport modules enhance flexibility and can halve the tact time of pick-and-place component handling. The demonstration also featured the new
YK400XE SCARA robot, which handles 30% heavier loads with increased excursion speed.
Finally, continuing to drive innovations that boost placement speed and flexibility, Yamaha presented its latest high-speed Sigma machines and iPulse mounters for placing components accurately on 3D substrates. There was also a hint at what’s to come, from the prototype Next-Generation Mounter machine at the centre of the booth.
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On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
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Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.