-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueCertifications
Certifications have historically been seen as a cost of doing business, but how do we turn them into a positive ROI and a value to both customer and vendor?
The Butterfly Effect
The basis of chaos theory is a key concept known as the “butterfly effect.” It’s the idea that a small event in one place creates a cascading set of events elsewhere. So, how is the EMS landscape changing? We’re tracking the concerns and dynamics of this landscape, and there’s a lot to learn.
Coming to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Rehm Thermal Systems’ Three-mode Oven
November 28, 2019 | Real Time with...productronicaEstimated reading time: Less than a minute
![](https://iconnect007.com/application/files/7616/3132/8563/Michael_Hanke-REHM.jpg)
During productronica 2019, the I-Connect007 Editorial Team met with some of the industry's top executives, managers, and engineers. In this video interview, part of the productronica coverage, the I-Connect007 team speaks with Michael Hanke, Chief Sales Officer for Rehm.
Editor Nolan Johnson and Michael Hanke discuss the company’s new three-mode oven. In addition, Nolan and Michael address data analysis and reporting advances in Rehm’s products, such as HMI software, which is integrated into the machinery and smartphone interfaces for global visibility, without operator or set-up complexity.
The productronica show is one of the world’s leading trade fairs for electronics development and production. The productronica trade fair is held on alternating years, at the Messe München in Munich, Germany. The next productronica will be held November 16-19, 2021.
Watch video below:
Suggested Items
Summit Interconnect Welcomes Bobby Johnson as New Vice President of Human Resources
07/19/2024 | Summit Interconnect, Inc.Summit Interconnect, a leading provider of advanced PCB manufacturing, is pleased to announce the appointment of Bobby Johnson as the new Vice President of Human Resources. Johnson brings a proven track record in human resources leadership, making him a valuable addition to the Summit Interconnect team.
Global Citizenship: Bringing Two Cultures Together in PCB Manufacturing
07/17/2024 | Tom Yang -- Column: Global CitizenshipWelcome to my new column. My name is Tom Yang, and I am the CEO of CEE PCB, a family-owned global printed circuit board business. I was actually educated in California, earning my bachelor’s and master’s degrees in finance at Cal State. After graduating, I worked in investment banking for a while, then came to work at CEE, where I have been ever since.
ROCKA Solutions Continues Expansion in Brazil with New Location in Manaus
07/17/2024 | ROCKA SolutionsROCKA Solutions announced the continued expansion of its operations in Brazil. Having expanded into Brazil earlier this year with a location in São Paulo, the company is pleased to announce an upcoming second location in Manaus.
STARTEAM's Hong Kong and Shenzhen Offices Achieve ISO 27001 Certification
07/08/2024 | STARTEAM GLOBALSTARTEAM is pleased to announce that its Hong Kong and Shenzhen offices have successfully achieved ISO 27001 certification. This accomplishment follows the certification of its Karlsruhe office in April 2024, ensuring that all primary offices now meet the highest standards of information security.
GlobalFoundries Acquires Tagore Technology’s GaN Technology to Accelerate Disruptive Power Management Solutions
07/02/2024 | GlobalFoundriesGlobalFoundries (GF) announced that it has acquired Tagore Technology’s proprietary and production proven Power Gallium Nitride (GaN) IP portfolio, a high-power density solution designed to push the boundaries of efficiency and performance in a wide range of power applications in automotive, internet of things (IoT) and artificial intelligence (AI) datacenter.