Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Nolan’s Notes: Everyone Has Their Eye on India
Latest iNEMI Roadmap Chapters Cover Ceramic Interconnect & Photovoltaics, Connectors, and Passive Components
December 5, 2019 | iNEMIEstimated reading time: 2 minutes
The International Electronics Manufacturing Initiative (iNEMI) has released three additional chapters from its 2019 Roadmap. The Ceramic Interconnect & Photovoltaics, Connectors, and Passive Components chapters are now available online, along with 13 additional chapters already published.
Chapter Highlights
Ceramic Interconnect & Photovoltaics — This chapter provides an update on several key ceramic interconnect technologies, such as thick film, high and low-temperature co-fired, thin film, pure copper metallization on ceramic, and lead-free thick film. It provides direction on industry and technology needs including design tool, material and processing developments and cost reduction opportunities to address future market expectations in terms of performance and cost. Innovative ceramic interconnection substrate technology is a key enabling technology for mobile device applications, future networks (e.g., 5G), and IoT devices and applications. In addition, the chapter updates on the status of the photovoltaic industry and includes a section covering crystalline silicon solar cell design, fabrication and testing.
Connectors — Providing comprehensive information about electronic connectors, this chapter includes an overview of the current situation as well as projected technology enhancements and challenges over the 10-year roadmap horizon. It presents business, component, and substrate trends, and the impact of these trends on the manufacturing processes for surface mount, part placement, wave and selective soldering, press-fit and rework/repair.
Passive Components — The Passive Components chapter discusses technology needs and recommendations for capacitors, resistors, magnetics and circuit protection components, which are the highest volume passive components in electronic devices. They support power management, signal conditioning, and protection of active devices. This chapter, which was developed in collaboration with the Electronic Components Industry Association (ECIA), presents four areas of common cross-cut requirements: (1) environmental compliance with rapidly changing regulatory requirements, (2) component sensitivity to board mount conditions, (3) increased customer sensitivity to non-graceful failure modes of components, and (4) issues with counterfeit components. It also focuses on the specific needs for passives components in key markets such as automotive, medical and high-end systems.
Now Available
The 2019 Roadmap is now available on the iNEMI website. It is free for iNEMI members and chapters are $500 each for non-members. Special pricing is available for non-profit organizations, including universities, research institutes and government agencies. For additional information: https://www.inemi.org/2019-roadmap-overview
For the 2019 Roadmap, chapters are being published in waves, with new chapters released every two to three weeks. The first four waves, already available online, included the following 13 chapters: Aerospace & Defense; Board Assembly; High-End Systems; Industrial Internet of Things; Mass Data Storage; Medical; MEMS & Sensors; Modeling, Simulation & Design Tools; Optoelectronics; Power Conversion Electronics; Semiconductor Technologies; Smart Manufacturing; and Sustainable Electronics.
About iNEMI
The International Electronics Manufacturing Initiative’s mission is to forecast and accelerate improvements in the electronics manufacturing industry for a sustainable future. The consortium is made up of more than 90 manufacturers, suppliers, industry associations and consortia, government agencies, research institutes and universities. iNEMI roadmaps the needs of the electronics industry, identifies gaps in the technology infrastructure, executes collaborative projects to eliminate these gaps (both business and technical) and stimulates standards activities to speed the introduction of new technologies. The consortium also works with government agencies, universities and other funding agencies to set priorities for future industry needs and R&D initiatives. iNEMI is based in Morrisville, North Carolina (in the Greater Raleigh/Research Triangle Park area). For additional information about iNEMI, visit http://www.inemi.org.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
TTCI and The Training Connection Strengthen Electronics Manufacturing with Test Services and Training at PCB West 2025
09/16/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB West 2025, taking place Wednesday, October 1, 2025, at the Santa Clara Convention Center in California. Visitors are invited to Booth 113 to explore the companies’ complementary expertise in test engineering services and workforce development for the electronics industry.
Beyond the Board: What Companies Need to Know Before Entering the MilAero PCB Market
09/16/2025 | Jesse Vaughan -- Column: Beyond the BoardThe MilAero electronics supply chain offers opportunities for manufacturers that are both prestigious and strategically important. Serving prime contractors and Tier-1 suppliers can mean long-term program stability and the satisfaction of contributing to national security. At the same time, this sector is unlike commercial electronics in almost every respect. Success requires more than technical capabilities, it requires patience, preparation, attention to detail, and a clear understanding of how the business model differs.
India’s Aerospace and Defence Engineered for Power, Driven by Electronics
09/16/2025 | Gaurab Majumdar, Global Electronics AssociationWith a defence budget of $82.05 billion (2025–26) and a massive $223 billion earmarked for aerospace and defence spending over the next decade, India is rapidly positioning itself as a major player in the global defence and aerospace market.
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
Global Interposer Market to Surge Nearly Fivefold by 2034
09/15/2025 | I-Connect007 Editorial TeamRevenue for the global interposer market is projected to climb from $471 million in 2025 to more than $2.3 billion by 2034, according to a new report from Business Research Insights. The growth represents a CAGR of nearly 20 percent over the forecast period.