- pcb007 Magazine
Latest IssuesCurrent Issue
The Registration Sweet Spot
Registration is underrated and underappreciated. The key is to ensure proper registration from layer to layer across the entire printed circuit board. It’s a holistic process requiring anticipation, prediction, precise attention at each step, and detailed data tracking and monitoring.
- Events||| MENU
- pcb007 Magazine
GaN Systems Showcases How Smaller, Lighter, and More Efficient Power Electronics Spurns Tech Innovation at CES 2020December 5, 2019 | GaN Systems
Estimated reading time: Less than a minute
During CES 2020, GaN Systems, the global leader in GaN (gallium nitride) power semiconductors, will be exhibiting the latest technology innovations that are addressing energy efficiency challenges by using GaN as a building block for power electronics systems that are 4X smaller, 4X lighter, and generate 4X less energy loss.
GaN power semiconductors are transforming the future in several industries including consumer electronics, industrial, and automotive.
Customer product demonstrations at CES 2020 include:
- Power supplies and AC Adapters from 65W to 3kW with very high-power density
- Highest efficiency Class D audio amplifiers with superlative sound quality
- Wireless Power for 5G Fixed Wireless Access, scooters, drones, robots, and consumer electronics
- Automotive onboard charger and traction inverter with industry-leading power density
- The world’s most powerful LiDAR laser/driver
WHEN: January 7-10, 2020
WHERE: Tech East, Renaissance Hospitality Suites (next to the Las Vegas Convention Center)
If you’re interested in learning more about GaN Systems and GaN technology’s impact in consumer devices, 5G, autonomous and electric vehicles and more, please visit gansystems.com/ces-2020 to schedule an appointment.
Panasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
In my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering09/18/2023 | ViTrox
ViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.
I have been in and around circuit boards most of my life. I started 20 years ago in my family’s PCB shop, leaving after a couple of years to start my own software company. About a year ago, I returned to the family business, and the first thing I noticed was that nothing had really changed. We were doing the same things in the same way as the day I left. After talking to several experts in the industry, I realized it was worse than that: The manufacturing of PCBs had not changed in 70 years.