-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueWet Process Control
In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
Don’t Just Survive, Thrive
If we are to be relevant and prosper during these next critical decades in electronics, we must do more than survive. As an industry, we can and must thrive. In this issue, our contributors explore these concepts meant to help you take your business to the next level.
Material Matters
Materials management is nuanced, multifaceted, and requires a holistic systems approach for business success. When building high mix, low volume, and high technology, managing materials and overall cost containment are even greater challenges.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Ventec Invests in Key Equipment to Support Expansion of PTFE Laminates Manufacturing
December 16, 2019 | Ventec International GroupEstimated reading time: 2 minutes
![](https://iconnect007.com/application/files/9016/3132/8687/Ventec_China.jpg)
Ventec International Group Co., Ltd. has significantly increased its PTFE laminate manufacturing capabilities following a strategic investment in a new state-of-the-art high-temperature press and lay-up/break-down line at its Suzhou (China) manufacturing plant.
With 5G and evermore sophisticated radar applications, the demand and requirements for low loss/high frequency material is accelerating. Critical RF/Microwave-, antenna-, power amplifier- and sub-assembly-applications require superior electrical performance that can be delivered through PTFE laminates. To serve the increasing demand of these PTFE type products, Ventec has strengthened its investment in its Suzhou manufacturing plant to be even better positioned for the increase in demand and meet customers accelerated radar and 5G deployment requirements.
The most recent important equipment investment in a new state-of-the-art high-temperature press and lay-up/break-down line at Ventec’s Suzhou (China) manufacturing plant delivers a significant increase in manufacturing capacity to meet the growing demand for PTFE laminates. This includes the launch and roll-out of tec-speed 30.0 - Ventec’s latest ceramic filled high-speed/high-frequency PTFE material range that offers the highest signal-integrity characteristics for the most advanced high-frequency systems such as 77~79 GHz automotive radar systems.
tec-speed 30.0 (VT-3703) offers:
- Dk 3.0 with extremely low Df (0.0009)
- DK-stability versus temperature
- Lower in-plane thermal expansion
The current Dk 3.0 tec-speed 30.0 version will be supplemented by Dk 6.15 and Dk 10.2 versions in the first half of 2020, offering an even wider range of options for applications such as automotive radar, cellular base stations, power amplifiers & antennas, global positioning satellite antennas, patch antennas for wireless communication or power backplanes.
Jason Chung, CEO said: "The investment and installation of the PTFE manufacturing line is yet another important piece of the puzzle in our global growth program. The addition of the line to our range of capabilities demonstrates to our customers our commitment to maintaining the most up-to-date manufacturing technologies that support our clients’ PCB design, development and manufacturing needs."
For more information about Ventec's solutions and the company’s wide variety of products, please visit www.venteclaminates.com.
About Ventec International Group
Ventec International Group Co., Ltd. (6672 TT) is a premier supplier to the Global PCB industry. With volume manufacturing facilities in Taiwan and China and distribution locations and manufacturing sites in both the US and Europe, Ventec specializes in advanced copper clad glass reinforced and metal backed substrates. Ventec materials, which include high-quality enhanced FR4, high-speed/low-loss- & high-performance IMS material technology and an advanced range of thermal management solutions, are manufactured by Ventec using strict quality-controlled processes that are certified to AS9100 Revision D, IATF 16949:2016 and ISO 9001:2015, and are backed by a fully controlled and managed global supply chain, sales- and technical support-network.
Suggested Items
Atotech to Participate at KPCA Show 2024
09/03/2024 | AtotechMKS’ Atotech will participate in this year’s KPCA Show 2024 in Incheon, held at Songdo Convensia from September 4-6, 2024.
Victory Announces Breakthrough in PCB Technology with New Product Launch
08/29/2024 | openPRShenzhen Victory Electronics Technology Co., Ltd., a leader in the printed circuit board (PCB) manufacturing industry, is proud to announce the successful development of a groundbreaking new product.
Connect the Dots: Designing for Reality—Electroless Copper
08/28/2024 | Matt Stevenson -- Column: Connect the DotsRoll up your sleeves because it's time to get messy. In a recent episode of I-Connect007’s On the Line with… podcast, we discussed electroless copper deposition. This process deposits a copper layer into the through-holes and vias of what will eventually be a PCB. Electroless copper deposition feels like a black box to many people. It sort of looks like a black box, too. The boards go in one side, come out the other, and emerge differently. So, let's crack open that black box and look inside.
Maximizing ROI Through Better Wet Process Control
08/20/2024 | I-Connect007 Editorial Team“When things get out of control, the variation in your wet process begins,” says Mike Carano,. “Just because they look like good boards and may even pass electrical test, it does not necessarily mean you have good boards. Once the chemistry is headed toward the right or left side of the process control parameter cliff, the plating is compromised. If the copper is thinner than it should be, when the customer puts it into service, the board may fail after 500 cycles vs. the requisite 1,000 or 2,000 cycles. The root cause issue is that you plated 7/10ths of a mil of copper instead of one-mil of copper because you were not controlling your process. The fact that you passed your own electric test becomes inconsequential.”
The Chemical Connection: Controlling an Alkaline Etch Bath With Low Copper Loading
08/07/2024 | Don Ball -- Column: The Chemical ConnectionThis month, I wanted to continue my discussion on how much process control is actually needed for high-density circuit production. However, in the last month, I have been called on to help with a specific process control problem: how to control an alkaline etch bath when you’re not etching much copper. This problem has been cropping up more frequently as smaller shops (and a few larger ones) concentrate on low-volume, high-value plated through-hole panels such as prototypes, resistor cores, etc.