Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
New Ultrasonic Coating System Advances Spray-On EMI Shielding Capabilities
January 14, 2020 | Sono-TekEstimated reading time: 1 minute
Sono-Tek Corporation (OTC BB: SOTK) announces the release of a new ultrasonic coating system, the FlexiCoat EMI, specifically designed for conformal spraying of EMI (Electromagnetic Interference) shielding material onto semiconductor packages. This new market is seeing growing interest and activity as a result of smaller devices requiring improved EMI shielding protection properties. Conventional techniques such as shield cans and SMT clips are inadequate for newer small devices. Ultrasonic coating is a cost-effective, faster and simpler alternative to expensive sputtering-based coating equipment.
Sono-Tek’s FlexiCoat EMI is an automated XYZ coating system specifically engineered and proven to spray copper and silver-filled shielding materials with precise control of coating characteristics and little overspray.
Sono-Tek ultrasonic nozzles are widely known for their low/no maintenance, non-clogging, high uniformity and highly repeatable performance. A special ultrasonic nozzle configuration was developed for these EMI applications to provide a more targeted spray area that reduces overspray drastically when compared with all other spray types. This new nozzle design is fully integrated into the FlexiCoat EMI system, along with an array of application-driven features to make the system a full coating solution for EMI shielding coatings.
Some features of the FlexiCoat EMI system include:
- 500x500 mm slides, conveyor and pumping system
- Proprietary ink mixing system to ensure ink stability over time
- UPH/throughput is significantly faster than sputtering at 1/10 the price
- Compatible with ink formulations from Tatsuta and other ink providers
- Uniform shielding coverage on top and sides of package is achieved using nozzle tilt
- Top surface: sidewall thickness ratio of 1: 0.6 ~ 0.7
Bennett Bruntil, Sono-Tek’s Vice President of Sales & Marketing, said: “Our entry into this growing semiconductor application was a natural outgrowth of our semiconductor coating expertise in other applications. Our equipment is quickly proving to be an excellent fit for companies looking for an effective, low-cost alternative to sputtering for deposition of new copper and silver-filled epoxy materials on the market.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Electrodeposited Copper Foils Market to Grow by $11.7 Billion Over 2025-2032
09/18/2025 | Globe NewswireThe global electrodeposited copper foils market is poised for dynamic growth, driven by the rising adoption in advanced electronics and renewable energy storage solutions.
MacDermid Alpha Showcases Advanced Interconnect Solutions at PCIM Asia 2025
09/18/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronic Solutions, a global leader in materials for power electronics and semiconductor assembly, will showcase its latest interconnect innovations in electronic interconnect materials at PCIM Asia 2025, held from September 24 to 26 at the Shanghai New International Expo Centre, Booth N5-E30
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.
Closing the Loop on PCB Etching Waste
09/09/2025 | Shawn Stone, IECAs the PCB industry continues its push toward greener, more cost-efficient operations, Sigma Engineering’s Mecer System offers a comprehensive solution to two of the industry’s most persistent pain points: etchant consumption and rinse water waste. Designed as a modular, fully automated platform, the Mecer System regenerates spent copper etchants—both alkaline and acidic—and simultaneously recycles rinse water, transforming a traditionally linear chemical process into a closed-loop system.
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
09/08/2025 | Kurt Palmer -- Column: Driving InnovationIn PCB manufacturing, the demand for increasingly complex and miniaturized designs continually pushes the boundaries of traditional fabrication methods, including depth routing. Success in these applications demands not only on robust machinery but also sophisticated control functions. PCB manufacturers rely on advanced machine features and process methodologies to meet their precise depth routing goals. Here, I’ll explore some crucial functions that empower manufacturers to master complex depth routing challenges.