-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueCertifications
Certifications have historically been seen as a cost of doing business, but how do we turn them into a positive ROI and a value to both customer and vendor?
The Butterfly Effect
The basis of chaos theory is a key concept known as the “butterfly effect.” It’s the idea that a small event in one place creates a cascading set of events elsewhere. So, how is the EMS landscape changing? We’re tracking the concerns and dynamics of this landscape, and there’s a lot to learn.
Coming to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
MacDermid Alpha Electronics Solutions to Highlight the Kester Integration at IPC APEX EXPO 2020
January 21, 2020 | MacDermid Alpha Electronics SolutionsEstimated reading time: 2 minutes
![](https://iconnect007.com/application/files/2016/3132/9383/APEX2020.jpg)
MacDermid Alpha Electronics Solutions, leaders in innovative electronic interconnect technologies, will feature Affinity 2.0, their highly stable, low corrosion ENIG process and the ALPHA® HiTech™ portfolio of low temperature adhesives, encapsulants, and underfills, at the IPC APEX Conference and Expo, February 1-6, in San Diego, California.
Advanced technologies often bring increased complexity, but well-designed technologies bring performance and simplicity. The Affinity 2.0 process’ highly stable activation and nickel plating allows for an ultra-uniform gold deposition with exceptional control. The Circuitry Solutions division will also highlight their complete line of leading-edge copper filled microvia and electroless copper processes.
A recent addition to the Assembly Solutions division, the ALPHA HiTech series of low temperature adhesives, encapsulants, and underfills is a one-stop bonding platform designed to reduce the scale-up risk for component assemblies deployed into demanding applications. ALPHA HiTech materials exhibit superior drop-shock, impact bend and thermal cycle performance. Their wide processing range has proved to be beneficial for assemblies, especially those incorporating temperature sensitive components. The ALPHA HiTech suite of products has broad application potential for Automotive, Medical, Smartphone, and White Goods assemblies.
This year, MacDermid Alpha Electronics Solutions is proud to welcome Kester to its electronics business. The acquisition of Kester reflects the strategic goals of MacDermid Alpha to expand its expertise and offerings throughout the electronics manufacturing supply chain. “The addition of Kester’s talent and expertise will be an important asset in achieving our goal of providing customers with leading products and solutions to ensure highest reliability and performance,” said Tim Williams, Vice President of the MacDermid Alpha Assembly Solutions division.
The Kester team will showcase their innovative assembly products, including 268 Flux-Cored Wire, high reliability products: NP505-HR Solder Paste, 275 Flux-Cored Wire, Select-10 Selective Soldering Flux, NF372-TB Soldering Flux and RF550, and solder pastes: NP560, WP616, NP545 and NP505-LT.
For additional information about MacDermid Alpha’s latest technologies and products, please visit Booth #1824 at IPC APEX, or contact us @ info@macdermidalpha.com
About MacDermid Alpha Electronics Solutions
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, and MacDermid Enthone brands, we provide solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find out more at MacDermidAlpha.com.
Suggested Items
Altus Highlights Success of Essemtec's I2S in the UK and Ireland Market
07/23/2024 | Altus GroupAltus Group, a leading distributor of capital equipment for the electronics industry in the UK and Ireland, is pleased to highlight the success of Essemtec's Integrated Inspection System (I2S).
Automatic Paste Transfer and Quick Change Squeegee for ASMPT Printers
07/23/2024 | ASMPTASMPT, the market and innovation leader in SMT manufacturing technology, has added two new features to its proven DEK printing platforms that automate solder paste transfers and simplify squeegee changes.
New Breakthrough in Double-Sided Reflow Part Retention from Alltemated
07/19/2024 | AlltematedAlltemated's PLACE-N-BOND™ underfilm passed testing and was implemented in volume production to aid in component retention during the second pass reflow of printed circuit assemblies. This successful testing and implementation occurred in various applications with components such as capacitors, inductors, transformers, connectors, and larger ICs.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics, Chapter 2
07/17/2024 | I-Connect007 Editorial TeamIn this chapter, we’ll focus on the most important analytics at the forefront of SMT, from the solder paste machine to placement machines, and breakdown these metrics from the perspectives of the different decision makers involved in the process. The lead SMT shift manager isn’t going to have the same concerns as a quality manager, so it’s important to look at how each machine and operation contains valuable KPIs for each role.
SMTA Heartland Chapter Announces Rescheduled Date for High Reliability: Virtual STAR Forum
07/10/2024 | SMTAThe SMTA Heartland Chapter announces the rescheduled date for the High Reliability: Virtual STAR Forum, following the overwhelming success of our May event. Join us on Tuesday, July 30, 2024, for an afternoon of engaging discussions and expert insights into high-reliability manufacturing.