-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Austin American Technology Offers the Only All-In-One Aqueous Batch Cleaner/Rose Tester
January 22, 2020 | Austin American Technology Corp.Estimated reading time: Less than a minute

Austin American Technology today announced they will exhibit the Aqua ROSE™, which is the only all-in-one aqueous batch cleaner and rose tester on the market, and the Mega ION® pre-seal circuit cleaner and cleanliness tester in Booth #2352 at the 2020 IPC APEX EXPO, scheduled to take place Feb 4-6, at the San Diego Convention Center in California.
The Aqua ROSE™ introduces a new era to batch cleaning / Ionic Contamination Testing. Experience a batch cleaner that offers multiple cleaning and testing technologies for capability previously unachieved in a compact footprint. In addition to aqueous and aqueous chemistry-based cleaning, the innovative Aqua ROSE™ supports process temperature ranges from ambient to 176°F. An intuitive user interface allows the operator to select the type and duration of wash, number of rinse cycles, and duration of the forced-air dry cycle.
The Mega ION® is the ideal pre-conformal coating cleaner, boasting multiple solvents selection, built-in solvent recycling, low cost of operation, is compliant to NFPA safety standards and has a very low solvent consumption.
Please stop by Booth #2352 at the IPC APEX EXPO, and for more information on Austin American Technology, please visit www.aat-corp.com.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.