The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Smart Automation: The Power of Data Integration in Electronics Manufacturing
The Government Circuit: From Tax Policy to Tariffs, Denver to Delhi, Speaking Up for Electronics 
MacDermid Alpha’s ALPHA OM-550 Solder Paste to be Demonstrated by Vermes Microdispensing at IPC APEX EXPO
February 3, 2020 | MacDermid Alpha Electronics SolutionsEstimated reading time: 2 minutes
MacDermid Alpha Electronics Solutions, leaders in innovative electronic interconnect technologies, will have its revolutionary low temperature solder paste, ALPHA OM-550 HRL1 demonstrated by Vermes Microdispensing on their latest solder paste jetting dispense system, MDS 1560 with DST(Dynamic Shockwave Technology), during this year’s IPC APEX EXPO Conference and show, February 1-6, in San Diego, California.
Vermes Microdispensing, a world leader in the design and manufacture of advanced microdispensing systems, has had considerable success with jet dispensing the ALPHA OM-550 HRL1 solder paste and will be running this paste using its MDS 1560 jetting head in Booth #1602. “We are excited with the success Vermes has had with our latest generation of low temperature solder paste,” said Paul Salerno, Global SMT Portfolio Manager at MacDermid Alpha Electronics Solutions. “Customers will be pleased with the performance of this paste in a jet dispensing application.”
Alpha, a brand of MacDermid Alpha Electronics Solutions, is a leader in innovative materials for electronics assembly. In addition to the suite of Alpha materials for low temperature assembly solutions, the new ALPHA HiTech™ Adhesives and Encapsulants, Void Reduction Solutions (VRS), and range of materials for automotive assemblies will be promoted.
To learn more about MacDermid Alpha’s solutions to optimize component reliability and assembly visit us during IPC APEX at Booth #1824 or visit MacDermidAlpha.com
About Vermes Microdispensing
Headquartered in Germany, VERMES Microdispensing revolutionized microdispensing technology with the introduction of its contact free piezo-based MDS 3000 series in 2001. Today, the company is a world leader in the design and manufacture of innovative microdispensing concepts and systems for adhesives, silicones, greases, solvents and other fluids. VERMES high precision MDS 3000 valves support modern manufacturing processes across the globe. Their systems enable our customers to achieve contact free dispensing of highly viscous media droplets in the micro and nano-liter range at theoretical frequencies of more than 3000 Hz; a rate that is unique in the industry. Find out more at vermes.com.
About MacDermid Alpha Electronics Solutions
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, and MacDermid Enthone brands, we provide solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find out more at MacDermidAlpha.com.
Share on:
Suggested Items
SolderKing’s Successful Approach to Modern Soldering Needs
06/18/2025 | Nolan Johnson, I-Connect007Chris Ward, co-founder of the family-owned SolderKing, discusses his company's rapid growth and recent recognition with the King’s Award for Enterprise. Chris shares how SolderKing has achieved these award-winning levels of service in such a short timeframe. Their secret? Being flexible in a changing market, technical prowess, and strong customer support.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
06/09/2025 | Dr. Eyal Weiss, CybordAs the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.