This month, we take you inside the annual trade show of the Global Electronics Association, to preview the conferences, standards, keynotes, and other special events new to the show this year.
Innovation rippled across the entire electronics supply chain in 2025, from semiconductor packaging and substrate materials to denser boards and more robust designs. This issue explores these defining moments and what we can expect in the year to come.
When customer requirements shift, responses range from new equipment to automation. Explore the newest solutions reshaping production and how today’s market dynamics are driving these trends.
Powering the Future: From Thick-Film to DBC—Understanding the Evolution of Ceramic Packaging
Global Sourcing Spotlight: The New Landscape of Manufacturing 
Nolan’s Notes: Five Key Changes to APEX EXPO
